211018 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Applying energy for connecting with energy being in the form of electromagnetic radiation Induction heating, i.e. eddy currents
BONDING APPARATUS AND OPERATING METHOD THEREOF
#2Devices with conductive or magnetic nanowires for localized heating and connection
#3Magnetic induced heating for solder interconnects
#4Magnetic intermetallic compound interconnect
#5Flip-chip bonder with induction coils and a heating element
#6Solder bump reflow by induction heating
#7Reactive bonding of a flip chip package
#8Magnetic attachment structure
#9MAGNETIC PARTICLE ATTACHMENT MATERIAL
#10Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves
#11Magnetic attachment structure
#12Attachment using magnetic particle based solder composites
#13Coil and semiconductor apparatus having the same
#14METHOD AND APPARATUS FOR RAPID THERMAL PROCESSING AND BONDING OF MATERIALS USING RF AND MICROWAVES
#15Method for bonding metallic terminals by using elastic contact
#16Mounting substrate
#17Component mounting method, component mounting apparatus, and ultrasonic bonding head
#18Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves
#19Assembly packaging using induction heating
#20Method for separating electronic component from organic board
#21Method for making electronic packages
#22Assembly packaging using induction heating
#23Electronic component mounting method and apparatus and ultrasonic bonding head