H01L2224/8134 - CPC Classification Index

ClassID:

211026 ⎘

H01L2224/8134 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector Bonding interfaces of the bump connector

Sub-classes:

H01L2224/81345 » Shape, e.g. interlocking features 84
H01L2224/81355 » having an external coating, e.g. protective bond-through coating 30
H01L2224/81359 » Material 20

Recent Application in this class:

20250246571

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THEREOF

20240128217

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

20240021564

Semiconductor package and method of forming thereof

20220278066

Semiconductor package and method of forming thereof

20210280542

Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof

20200020654

Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof

20170194274

Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof

20120135201

Semiconductor structures and method for fabricating the same

20080160751

MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF AND METHOD OF MAKING SAME

15141628

Integrated circuit package having two substrates