211035 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Bonding interfaces outside the semiconductor or solid-state body Shape, e.g. interlocking features
Interposers with alignment fences and semiconductor device assemblies including the interposers
#302Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein
#303Packing method for electronic components
#304Alignment fences and devices and assemblies including the same
#305Flip chip interconnection having narrow interconnection sites on the substrate
#306Contacting device, testing method and corresponding production method
#307Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board
#308Method to accommodate increase in volume expansion during solder reflow
#309Semiconductor device and method of manufacturing thereof
#310Three-dimensional device fabrication method
#311Interconnect including a pliable surface and use thereof
#312Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#313Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#314Substrates including alignment fences
#315Flip-chip package substrate with a high-density layout
#316Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
#317Module for a data carrier with improved bump counterparts
#318High density nanostructured interconnection
#319Mounting substrate and mounting method of electronic part
#320Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same
#321UBM for fine pitch solder ball and flip-chip packaging method using the same
#322Semiconductor device having curved leads offset from the center of bonding pads
#323Printed circuit board unit with detachment mechanism for electronic component
#324Semiconductor package with improved ball land structure
#325Integrated mechanical aids for high accuracy alignable-electrical contacts
#326Integrated mechanical aids for high accuracy alignable-electrical contacts