211083 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
Sub-classes:DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
#2Die attached leveling control by metal stopper bumps
#3Die attached leveling control by metal stopper bumps
#4Method of producing an interposer with microspring contacts
#5Systems, methods and devices for inter-substrate coupling
#6Systems, methods and devices for inter-substrate coupling
#7Flip-chip hybridisation of two microelectronic components using a UV anneal
#8Electrical connector
#9Technique for controlling positions of stacked dies
#10SEMICONDUCTOR DEVICE INTERCONNECT
#11Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing
#12Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
#13Microsprings partially embedded in a laminate structure and methods for producing same
#14Interposer with microspring contacts
#15Ramp-stack chip package with static bends
#16Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing
#17Detection device and method for manufacturing the same
#18Microelectronic contact structure
#19INTERCONNECT ASSEMBLIES AND METHODS