H01L2224/81905 - CPC Classification Index

ClassID:

211088 ⎘

H01L2224/81905 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector Combinations of bonding methods provided for in at least two different groups from -

Sub-classes:

H01L2224/81906 » Specific sequence of method steps 28
H01L2224/81907 » Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step 73

Recent Application in this class:

20190267265

Method and apparatus for embedding semiconductor devices

20170188468

Resin fluxed solder paste, and mount structure

20160247778

Localized sealing of interconnect structures in small gaps

20140027920

Semiconductor device and method for manufacturing the same

20130175698

Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias

20120111617

Electronic element unit and reinforcing adhesive agent

20120074563

Semiconductor apparatus and the method of manufacturing the same

20110139856

Bonding structure and method for manufacturing same

20090242121

LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCONNECT

15280524

Advanced metal-to-metal direct bonding