H01L2224/82121 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Aligning Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors

• H01L2224/82122 » by detecting inherent features of, or outside, the semiconductor or solid-state body 0
• H01L2224/8213 » using marks formed on the semiconductor or solid-state body 6
• H01L2224/82132 » using marks formed outside the semiconductor or solid-state body, i.e. "off-chip" 15