211156 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Aligning involving movement of a part of the bonding apparatus being the lower part of the bonding apparatus, i.e. holding means for the bodies to be connected, e.g. XY table Rotational movements