211168 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
Package structure including two joint structures including different materials and method for manufacturing the same
#2Display device and method for fabricating the same
#33D printed hermetic package assembly and method
#4Remapped packaged extracted die with 3D printed bond connections
#5Integrated circuit with printed bond connections
#6Method and apparatus for printing integrated circuit bond connections
#7FIXING TECHNOLOGY FOR COMPONENT ATTACH