H01L2224/8234 - CPC Classification Index

ClassID:

211175 ⎘

H01L2224/8234 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] Bonding interfaces of the connector

Sub-classes:

H01L2224/82345 » Shape, e.g. interlocking features 5
H01L2224/82355 » having an external coating, e.g. protective bond-through coating 3
H01L2224/82359 » Material 2

Recent Application in this class:

20250246571

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THEREOF

20240021564

Semiconductor package and method of forming thereof

20220278066

Semiconductor package and method of forming thereof

20220085003

Semiconductor device

20220069093

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

20190081023

Recessed and embedded die coreless package

20180012871

RECESSED AND EMBEDDED DIE CORELESS PACKAGE

20170125385

Recessed and embedded die coreless package

20150357312

Recessed and embedded die coreless package

20140357024

Recessed and embedded die coreless package

20110156231

Recessed and embedded die coreless package