H01L2224/8236 - CPC Classification Index

ClassID:

211179 ⎘

H01L2224/8236 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] Bonding interfaces of the semiconductor or solid state body

Sub-classes:

H01L2224/82365 » Shape, e.g. interlocking features 12
H01L2224/82375 » having an external coating, e.g. protective bond-through coating 3
H01L2224/82379 » Material 2

Recent Application in this class:

20260047453

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

20190081023

Recessed and embedded die coreless package

20180359874

Electronic module and method for producing same

20180012871

RECESSED AND EMBEDDED DIE CORELESS PACKAGE

20170125385

Recessed and embedded die coreless package

20150357312

Recessed and embedded die coreless package

20150001709

Semiconductor device and method of stacking semiconductor die on a fan-out WLCSP

20140357024

Recessed and embedded die coreless package

20110156231

Recessed and embedded die coreless package