211186 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Bonding interfaces outside the semiconductor or solid-state body Material
Electrode connection structure and electrode connection method
#2BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER
#3Three-dimensional structure in which wiring is provided on its surface
#4Discrete device mounted on substrate
#5Package unit and stacking structure thereof
#6Method for metalizing blind vias