211188 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Bonding techniques Soldering or alloying
Sub-classes:BACK-TO-BACK THREE-DIMENSIONAL STACKED FAN-OUT PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF, BACK-TO-BACK THREE-DIMENSIONAL STACKED FAN-OUT PACKAGING MODULE AND PREPARATION METHOD THEREOF
#2Hybrid bridged fanout chiplet connectivity
#3Chip package structure and manufacturing method thereof
#4Microcontroller unit and fabrication method thereof
#5Method for producing an electric circuit comprising a circuit carrier, contact areas, and an insulating body
#6Method Of Manufacturing Semiconductor Package Board
#7Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections