211211 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Bonding techniques; Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding
WAFER BONDING METHOD AND BONDED WAFER
#2WAFER BONDING METHOD AND BONDED WAFER
#3Semiconductor Device and Method of Forming the Same
#4METHOD OF FORMING AN INTEGRATED OPTICAL CHIP PACKAGE DEVICE AND METHOD OF FORMING SAME
#5MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING PRODUCTION METHOD
#6THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
#7Semiconductor device and method of forming the same
#8Redistribution layer (RDL) layouts for integrated circuits
#9METHOD OF MANUFACTURING THREE-DIMENSIONAL SYSTEM-ON-CHIP AND THREE-DIMENSIONAL SYSTEM-ON-CHIP
#10Semiconductor device and method of forming the same
#11DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
#12WAFER BONDING METHOD AND BONDED WAFER
#13Engineered substrate with embedded mirror
#14Semiconductor device and method of forming the same
#15Forming metal bonds with recesses
#16Dielets on flexible and stretchable packaging for microelectronics
#17Redistribution layer (RDL) layouts for integrated circuits
#18Forming metal bonds with recesses
#19Releasable carrier method
#20Semiconductor device and method
#21Semiconductor device and method
#22Hybrid bond using a copper alloy for yield improvement
#23Semiconductor device and method
#24Semiconductor device and method
#25Releasable carrier and method
#263DIC interconnect apparatus and method
#27Method for metalizing blind vias
#28Dielets on flexible and stretchable packaging for microelectronics