211212 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Bonding techniques; Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces between electrically insulating surfaces, e.g. oxide or nitride layers
METHOD OF FORMING AN INTEGRATED OPTICAL CHIP PACKAGE DEVICE AND METHOD OF FORMING SAME
#2THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
#3CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKING PACKAGE, AND ELECTRONIC DEVICE
#4DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
#5Forming metal bonds with recesses
#6Dielets on flexible and stretchable packaging for microelectronics
#7Forming metal bonds with recesses
#8PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS
#9Hybrid bond using a copper alloy for yield improvement
#10Dielets on flexible and stretchable packaging for microelectronics