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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]; Post-treatment of the connector or the bonding area Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#2Preparation of compound semiconductor substrate for epitaxial growth via non-destructive epitaxial lift-off
#3Semiconductor package and method of fabricating semiconductor package
#4Methods for filling a contact hole in a chip package arrangement and chip package arrangements
#5Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections