211274 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Aligning; Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
Sub-classes:Assembly process for circuit carrier and circuit carrier
#2Placement method for circuit carrier and circuit carrier
#3Enhanced fiducial visibility and recognition
#4Multilayer substrate
#5Bonding system
#6Bonding systems
#7Multilayer substrate
#8Bonding method, storage medium, bonding apparatus and bonding system