Patents-Review.com
ClassID:

211279 ⎘

H01L2224/8313 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Aligning; Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body

Recent Application in this class:
#1
20250293187
2025-09-18

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #2
20250226243
2025-07-10

METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTURING DISPLAY DEVICE

 #3
20240355782
2024-10-24

INTEGRATED CIRCUIT PACKAGES

 #4
20240332249
2024-10-03

BONDING APPARATUS AND BONDING METHOD USING THE SAME

 #5
20240164022
2024-05-16

DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

 #6
20240038719
2024-02-01

NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE

 #7
20240021559
2024-01-18

FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE

 #8
20230378121
2023-11-23

BONDING APPARATUS AND BONDING METHOD

 #9
20230290734
2023-09-14

Method of manufacturing a three dimensional integrated semiconductor architecture having alignment marks provided in a carrier substrate

 #10
20230282607
2023-09-07

METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS REFLOW

 #11
20230238353
2023-07-27

Method of forming a bonded semiconductor structure

 #12
20230197625
2023-06-22

Semiconductor device with integrated decoupling and alignment features

 #13
20230178391
2023-06-08

Method for manufacturing display device and apparatus for manufacturing display device

 #14
20230163096
2023-05-25

MOUNTING DEVICE AND MOUNTING METHOD

 #15
20230067035
2023-03-02

Integrated circuit packages

 #16
20230005961
2023-01-05

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

 #17
20220406747
2022-12-22

Bonding apparatus and bonding method

 #18
20220375895
2022-11-24

MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE

 #19
20220375872
2022-11-24

Patterning a transparent wafer to form an alignment mark in the transparent wafer

 #20
20220375799
2022-11-24

Bonding apparatus and bonding method

 #21
20220310580
2022-09-29

Semiconductor device with through semiconductor via and method for fabricating the same

 #22
20220302077
2022-09-22

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

 #23
20220208720
2022-06-30

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

 #24
20220157737
2022-05-19

Three dimensional integrated semiconductor architecture having alignment marks provided in a carrier substrate

 #25
20220149027
2022-05-12

Display device

 #26
20210375780
2021-12-02

Patterning a transparent wafer to form an alignment mark in the transparent wafer

 #27
20210305201
2021-09-30

Bonding apparatus and method of fabricating display device using the same

 #28
20210288030
2021-09-16

Integrated circuit package and method

 #29
20210223597
2021-07-22

Display device and method for manufacturing display device

 #30
20210183803
2021-06-17

RECONSTRUCTED WAFER TO WAFER BONDING USING A PERMANENT BOND WITH LASER RELEASE

 #31
20210091027
2021-03-25

Array substrate and chip bonding method

 #32
20200381396
2020-12-03

Integrated circuit package and method

 #33
20200294984
2020-09-17

Semiconductor component, package structure and manufacturing method thereof

 #34
20200126951
2020-04-23

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

 #35
20200043884
2020-02-06

Wafer to wafer bonding method and wafer to wafer bonding system

 #36
20190312022
2019-10-10

Semiconductor component, package structure and manufacturing method thereof

 #37
20190206831
2019-07-04

Alignment method, method for connecting electronic component, method for manufacturing connection body, connection body and anisotropic conductive film

 #38
20190096867
2019-03-28

Semiconductor component, package structure and manufacturing method thereof

 #39
20180366353
2018-12-20

CHIP-BONDING SYSTEM AND METHOD

 #40
20180026012
2018-01-25

Multilayer substrate

 #41
20170330805
2017-11-16

Systems and methods for aligning and coupling semiconductor structures

 #42
20170236795
2017-08-17

Connection body

 #43
20170148759
2017-05-25

BONDING APPARATUS AND BONDING METHOD

 #44
20170110432
2017-04-20

Press fitting head and semiconductor manufacturing apparatus using the same

 #45
20160351532
2016-12-01

ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING CONNECTION BODY, CONNECTION BODY AND ANISOTROPIC CONDUCTIVE FILM

 #46
20160351531
2016-12-01

Connection body

 #47
20160327826
2016-11-10

Connection body, method for manufacturing a connection body, connecting method and anisotropic conductive adhesive agent

 #48
20160284566
2016-09-29

Semiconductor device mounting method

 #49
20160181229
2016-06-23

Mounting structure of semiconductor device and method of manufacturing the same

 #50
20150364384
2015-12-17

Placement method for circuit carrier and circuit carrier

 #51
20150130056
2015-05-14

Semiconductor device and method of manufacturing semiconductor device

 #52
20150108615
2015-04-23

Technique for controlling positions of stacked dies

 #53
20150087083
2015-03-26

Bonding apparatus

 #54
20150048523
2015-02-19

Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer

 #55
20150044786
2015-02-12

Alignment systems and wafer bonding systems and methods

 #56
20140334774
2014-11-13

Composite wafer including a molded wafer and a second wafer

 #57
20140065759
2014-03-06

Method for molecular adhesion bonding at low pressure

 #58
20140021624
2014-01-23

Mounting structure of semiconductor device and method of manufacturing the same

 #59
20130286614
2013-10-31

Composite wafer including a molded wafer and a second wafer

 #60
20130161782
2013-06-27

Heterogeneous chip integration with low loss interconnection through adaptive patterning

 #61
20130020723
2013-01-24

Composite layered chip package

 #62
20120313260
2012-12-13

Layered chip package and method of manufacturing same

 #63
20120313259
2012-12-13

Layered chip package and method of manufacturing same

 #64
20120153462
2012-06-21

Semiconductor device and method of manufacturing semiconductor device

 #65
20120119391
2012-05-17

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #66
20120108762
2012-05-03

Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus

 #67
20120056333
2012-03-08

Layered chip package and method of manufacturing same

 #68
20120056327
2012-03-08

Ramp-stack chip package with static bends

 #69
20120038027
2012-02-16

Method for molecular adhesion bonding at low pressure

 #70
20120021564
2012-01-26

Method for packaging semiconductor device

 #71
20120013024
2012-01-19

Layered chip package and method of manufacturing same

 #72
20110316141
2011-12-29

Layered chip package and method of manufacturing same

 #73
20110316123
2011-12-29

Laminated semiconductor substrate, laminated chip package and method of manufacturing the same

 #74
20110228506
2011-09-22

Electronic assembly with detachable components

 #75
20110223695
2011-09-15

Electronic assembly with detachable components

 #76
20110222253
2011-09-15

Electronic assembly with detachable components

 #77
20110222252
2011-09-15

Electronic assembly with detachable components

 #78
20110084382
2011-04-14

Chip package and fabrication method thereof

 #79
15372482
2018-04-03

Laser sintered interconnections between die