H01L2224/83143 - CPC Classification Index

ClassID:

211286 ⎘

H01L2224/83143 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Aligning Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium

Recent Application in this class:

20250385225

2025-12-18

FULL-COLOR LED DISPLAY USING ULTRA-THIN LED ELEMENT AND METHOD FOR MANUFACTURING THEREOF

20250385212

2025-12-18

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

20250293191

2025-09-18

METHOD AND SYSTEM FOR ASSEMBLING MICROELECTRONIC COMPONENTS

20250176105

2025-05-29

SELECTIVE TRANSFER OF MICRO DEVICES

20250070080

2025-02-27

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

20250015030

2025-01-09

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

20240381531

2024-11-14

SELECTIVE TRANSFER OF MICRO DEVICES

20240258270

2024-08-01

SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING THE SAME

20240128224

2024-04-18

Adhesive member, display device, and manufacturing method of display device

#10

20220415847

2022-12-29

FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN HYBRID BONDING SELF ASSEMBLY

#11

20220399299

2022-12-15

Display device and method of manufacturing the same

#12

20220310884

2022-09-29

Full-color LED display using ultra-thin LED element and method for manufacturing thereof

#13

20220271004

2022-08-25

Electronic device and method of transferring electronic element using stamping and magnetic field alignment

#14

20220254745

2022-08-11

Selective micro device transfer to receiver substrate

#15

20220216172

2022-07-07

Adhesive member, display device, and manufacturing method of display device

#16

20220199743

2022-06-23

Display device including anisotropic conductive film and method of manufacturing display device

#17

20220139857

2022-05-05

Selective micro device transfer to receiver substrate

#18

20220139856

2022-05-05

Selective micro device transfer to receiver substrate

#19

20220130783

2022-04-28

Selective micro device transfer to receiver substrate

#20

20220059496

2022-02-24

Electronic device and method of transferring electronic element using stamping and magnetic field alignment

#21

20210327740

2021-10-21

Selective micro device transfer to receiver substrate

#22

20210327739

2021-10-21

Selective micro device transfer to receiver substrate

#23

20210243894

2021-08-05

Selective transfer of micro devices

#24

20210151633

2021-05-20

Light emitting device and fluidic manufacture thereof

#25

20200350281

2020-11-05

Selective micro device transfer to receiver substrate

#26

20200219848

2020-07-09

Chip assembly

#27

20190319020

2019-10-17

Integrated multi-color light-emitting pixel arrays based devices by bonding

#28

20190287944

2019-09-19

ASICS face to face self assembly

#29

20190259729

2019-08-22

Process for manufacturing assembly pads on a carrier for the self-assembly of an electronic circuit on the carrier

#30

20190181304

2019-06-13

Light emitting device and fluidic manufacture thereof

#31

20190081021

2019-03-14

Method of manufacturing stacked wafer assembly

#32

20190013450

2019-01-10

Method for assembling a carrier with components, pigment for assembling a carrier with a component and method for producing a pigment

#33

20180358238

2018-12-13

Semiconductor device package having an underfill barrier

#34

20180211992

2018-07-26

Solution deposited magnetically guided chiplet displacement

#35

20180190614

2018-07-05

Massively parallel transfer of microLED devices

#36

20180130766

2018-05-10

3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix

#37

20180130765

2018-05-10

Method for bonding semiconductor chips to a landing wafer

#38

20180082976

2018-03-22

Method of forming a three-dimensional bonded semiconductor structure having nitridized oxide regions

#39

20180068982

2018-03-08

Chip assembly

#40

20180068921

2018-03-08

Methods and apparatus for self-alignment of integrated circuit dies

#41

20180005978

2018-01-04

Method for wafer-wafer bonding

#42

20170338199

2017-11-23

Transferring method, manufacturing method, device and electronic apparatus of micro-LED

#43

20170330857

2017-11-16

Transferring method, manufacturing method, device and electronic apparatus of micro-LED

#44

20170330856

2017-11-16

Assembling method, manufacturing method, device and electronic apparatus of flip-die

#45

20170317242

2017-11-02

Light emitting device and fluidic manufacture thereof

#46

20170117248

2017-04-27

Gallium arsenide devices with copper backside for direct die solder attach

#47

20170117247

2017-04-27

Method for bonding substrates

#48

20170069595

2017-03-09

3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix

#49

20160374211

2016-12-22

Method and apparatus for assembling a component with a flexible foil, as well as the assembled product

#50

20160197023

2016-07-07

Semiconductor device

#51

20160111408

2016-04-21

Light emitting diodes and a method of packaging the same

#52

20160111395

2016-04-21

Method of forming a chip assembly with a die attach liquid

#53

20150364411

2015-12-17

Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers

#54

20150262971

2015-09-17

Chip arranging method

#55

20150223346

2015-08-06

Dual solder layer for fluidic self assembly and electrical component substrate and method employing same

#56

20150214189

2015-07-30

Semiconductor device having multiple contact clips

#57

20150179605

2015-06-25

Method for aligning micro-electronic components

#58

20150087092

2015-03-26

Opto-mechanical alignment

#59

20150062248

2015-03-05

Method for bonding a chip to a substrate

#60

20150050761

2015-02-19

Light emitting diodes and a method of packaging the same

#61

20150048523

2015-02-19

Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer

#62

20140362457

2014-12-11

Slotted configuration for optimized placement of micro-components using adhesive bonding

#63

20140021595

2014-01-23

Semiconductor component support and semiconductor device

#64

20130307130

2013-11-21

Semiconductor device

#65

20130267066

2013-10-10

Semiconductor packages and methods of fabricating the same

#66

20130045569

2013-02-21

Method and apparatus for fabricating integrated circuit device using self-organizing function

#67

20120292775

2012-11-22

Mounting method and mounting device

#68

20120213980

2012-08-23

METHOD FOR THE SELF-ASSEMBLY OF ELECTRICAL, ELECTRONIC OR MICROMECHANICAL COMPONENTS ON A SUBSTRATE

#69

20120153496

2012-06-21

Method of fabricating a TSV for 3D packaging of semiconductor device

#70

20120104625

2012-05-03

Semiconductor packages

#71

20120091594

2012-04-19

Method of producing a chip package, and chip package

#72

20120021563

2012-01-26

Method and apparatus for manufacturing three-dimensional integrated circuit

#73

20110291302

2011-12-01

Method and apparatus for manufacturing an electronic assembly, electronic assembly manufactured with the method or in the apparatus

#74

20110249113

2011-10-13

METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION

#75

20110229642

2011-09-22

Method for disposing a component

#76

20110197429

2011-08-18

Method of Magnetically Driven Simultaneous Assembly

#77

20110127633

2011-06-02

Slotted configuration for optimized placement of micro-components using adhesive bonding

#78

20110067911

2011-03-24

METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE

#79

20110033976

2011-02-10

Self-assembly of chips on a substrate

#80

20100123163

2010-05-20

Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display

#81

20090290337

2009-11-26

Mounting method, mounted structure, manufacturing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display

#82