H01L2224/83209 - CPC Classification Index

ClassID:

211307 ⎘

H01L2224/83209 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Applying energy for connecting; Compression bonding applying isostatic pressure, e.g. degassing using vacuum or a pressurised liquid

Recent Application in this class:

20210272928

2021-09-02

Apparatus for bond wave propagation control

20210210455

2021-07-08

Structure for bonding and electrical contact for direct bond hybridization

20200051950

2020-02-13

Apparatus for bond wave propagation control

20190096848

2019-03-28

Apparatus for bond wave propagation control

20170243851

2017-08-24

APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL PARTS

20170229418

2017-08-10

Sintering device

20160155720

2016-06-02

Method and apparatus for chip-to-wafer integration

20140312102

2014-10-23

Semiconductor device manufacturing method

20140193931

2014-07-10

Method of bonding a substrate to a semiconductor light emitting device

#10

20140183758

2014-07-03

Method of manufacturing semiconductor device, block stacked body, and sequential stacked body

#11

20140084491

2014-03-27

Method for manufacturing electronic device and electronic device

#12

20140033518

2014-02-06

Vacuum thermal bonding apparatus

#13

20130240115

2013-09-19

Device and method for chip pressing

#14

20130040424

2013-02-14

Fixing semiconductor die in dry and pressure supported assembly processes

#15

20120279653

2012-11-08

Heating apparatus and implemented body manufacturing method

#16

20120199988

2012-08-09

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE

#17

20120018084

2012-01-26

Printed Circuit Board Assembly Manufacturing Device And Method

#18

20110020983

2011-01-27

Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus

#19

20100085723

2010-04-08

Mounting method using dilatancy fluid

#20

20100078770

2010-04-01

Lock and key through-via method for wafer level 3 D integration and structures produced

#21

20090038753

2009-02-12

Mounting method

#22

20080283579

2008-11-20

Method for bonding electronic components

#23

20080211143

2008-09-04

Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate

#24

20080211086

2008-09-04

Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate

#25

20070131353

2007-06-14

Apparatus and clocked method for pressure-sintered bonding