Patents-Review.com
ClassID:

211311 ⎘

H01L2224/83222 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Applying energy for connecting with energy being in the form of electromagnetic radiation Induction heating, i.e. eddy currents

Recent Application in this class:
#1
20250300121
2025-09-25

METHOD AND ARRANGEMENT FOR CONNECTING ELEMENTS TO A SUBSTRATE

 #2
20220157773
2022-05-19

Pressure sintering device and method for manufacturing an electronic component

 #3
20200219848
2020-07-09

Chip assembly

 #4
20180068982
2018-03-08

Chip assembly

 #5
20170294404
2017-10-12

Sinterable bonding material and semiconductor device using the same

 #6
20170144221
2017-05-25

Sintering materials and attachment methods using same

 #7
20160111395
2016-04-21

Method of forming a chip assembly with a die attach liquid

 #8
20140013595
2014-01-16

Methods for producing a bond and a semiconductor module

 #9
20130025922
2013-01-31

BONDING ENTITIES TO CONJOINED STRIPS OF CONDUCTIVE MATERIAL

 #10
20120319268
2012-12-20

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

 #11
20120319253
2012-12-20

Method of Manufacturing a semiconductor module and device for the same

 #12
20120261174
2012-10-18

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, ELECTRONIC MEMBER WITH CONDUCTIVE CONNECTING MATERIAL AND ELECTRONIC COMPONENT

 #13
20120249375
2012-10-04

Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for RF applications

 #14
20120214010
2012-08-23

CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS USING THE SAME

 #15
20120183781
2012-07-19

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL

 #16
20120114927
2012-05-10

Sintering materials and attachment methods using same

 #17
20120067412
2012-03-22

Soldering entities to a monolithic metallic sheet

 #18
20110278351
2011-11-17

MAGNETIC PARTICLE ATTACHMENT MATERIAL

 #19
20110127663
2011-06-02

Magnetic particle-based composite materials for semiconductor packages

 #20
20110127314
2011-06-02

Bonding material with exothermically reactive heterostructures

 #21
20110079631
2011-04-07

Joining of parts via magnetic heating of metal-aluminum powders

 #22
20090321923
2009-12-31

Magnetic particle-based composite materials for semiconductor packages

 #23
20090170247
2009-07-02

MAGNETIC PARTICLES FOR LOW TEMPERATURE CURE OF UNDERFILL

 #24
20080251904
2008-10-16

Curing layers of a semiconductor product using electromagnetic fields

 #25
20070105341
2007-05-10

Bonding a non-metal body to a metal surface using inductive heating

 #26
20070023486
2007-02-01

Apparatus and a method of soldering a part to a board

 #27
20050274454
2005-12-15

Magneto-active adhesive systems

 #28
20050186019
2005-08-25

Apparatus and method for die attachment