H01L2224/8334 - CPC Classification Index

ClassID:

211319 ⎘

H01L2224/8334 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector Bonding interfaces of the layer connector

Sub-classes:

H01L2224/83345 » Shape, e.g. interlocking features 32
H01L2224/83355 » having an external coating, e.g. protective bond-through coating 1
H01L2224/83359 » Material 41

Recent Application in this class:

20250192097

HIGH POWER MODULE PACKAGE STRUCTURES

20230253362

High power module package structures

20210118842

Method of Forming an Interconnection between an Electric Component and an Electronic Component

20190115247

ROOM TEMPERATURE METAL DIRECT BONDING

20160086899

Room temperature metal direct bonding

20160086872

Heat dissipation structure, fabricating method, and electronic apparatus

20140370658

Room temperature metal direct bonding

20110041329

Room temperature metal direct bonding

20070232023

Room temperature metal direct bonding

20050161795

Room temperature metal direct bonding