H01L2224/8336 - CPC Classification Index

ClassID:

211323 ⎘

H01L2224/8336 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector Bonding interfaces of the semiconductor or solid state body

Sub-classes:

H01L2224/83365 » Shape, e.g. interlocking features 89
H01L2224/83375 » having an external coating, e.g. protective bond-through coating 2
H01L2224/83379 » Material 11

Recent Application in this class:

20120218715

2012-08-30

Electronic component and method of manufacturing electronic component