H01L2224/8338 - CPC Classification Index

ClassID:

211327 ⎘

H01L2224/8338 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector Bonding interfaces outside the semiconductor or solid-state body

Sub-classes:

H01L2224/83385 » Shape, e.g. interlocking features 746
H01L2224/83395 » having an external coating, e.g. protective bond-through coating 16
H01L2224/83399 » Material 7

Recent Application in this class:

20180166416

2018-06-14

Method for transferring and placing a semiconductor device on a substrate

20160317068

2016-11-03

Electronic devices with encapsulating silicone based adhesive

20130147002

2013-06-13

Receiver module and device

20110292625

2011-12-01

Bonding pad structure