211350 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques; Soldering or alloying involving forming an intermetallic compound at the bonding interface
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#2SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#3METHOD OF MANUFACTURING A CHIP STRUCTURE AND CHIP STRUCTURE
#4CLIP
#5SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICALLY AND MECHANICALLY COUPLING FIRST AND SECOND POWER SEMICONDUCTOR CHIPS TO A LEADFRAME PART AND METHOD FOR FABRICATING THEA SEMICONDUCTOR PACKAGE
#6SOLDER BONDING ON AuSn BASIS WITH LOW BONDING TEMPERATURE
#7ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#8Batch Soldering of Different Elements in Power Module
#9Semiconductor device and method for fabricating a semiconductor device
#10LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
#11DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRONICS PACKAGE
#12Semiconductor package and method for fabricating a semiconductor package
#13Diffusion soldering with contaminant protection
#14SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A LAYER STRUCTURE, AND METHOD OF FORMING A CHIP PACKAGE
#15Light emitting diode display with redundancy scheme
#16Diffusion soldering with contaminant protection
#17Batch soldering of different elements in power module
#18LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDING PART AND A BONDING TARGET
#19Semiconductor packages with an intermetallic layer
#20Light emitting diode display with redundancy scheme
#21Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip
#22METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON FORMATION OF INTER-DIFFUSION LAYERS
#23Semiconductor package and method for fabricating a semiconductor package
#24Semiconductor device and method for fabricating a semiconductor device
#25Soldering a conductor to an aluminum layer
#26Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
#27Chip assembly
#28Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
#29Laser bonding method
#30SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#31Light emitting diode display with redundancy scheme
#32Device and method for producing a device
#33Solder alloy and junction structure using same
#34DIE BONDING TO A BOARD
#35Bonded structure and method of manufacturing the same
#36Hermetically sealed MEMS device and its fabrication
#37Method for applying a bonding layer
#38Light emitting diode display with redundancy scheme
#39Micro-transfer printing with volatile adhesive layer
#40Chip assembly
#41Non-eutectic bonding
#42Semiconductor packages with an intermetallic layer
#43Methods and apparatuses for high temperature bonding controlled processing and bonded substrates formed therefrom
#44Method and apparatus for creating a bond between objects based on formation of inter-diffusion layers
#45Die bonding to a board
#46Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite material
#47Chip package assembly and manufacturing method thereof
#48Method for the diffusion soldering of an electronic component to a substrate
#49Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel
#50Method for applying a bonding layer
#51Semiconductor device in which an electrode of a semiconductor element is joined to a joined member and methods of manufacturing the semiconductor device
#52Semiconductor device and method of manufacturing semiconductor device
#53Method of forming a chip assembly with a die attach liquid
#54Lead frame construct for lead-free solder connections
#55Semiconductor device and method of manufacturing the same
#56Batch process for connecting chips to a carrier
#57Light emitting diode display with redundancy scheme
#58Sealing structure for a bonded wafer and method of forming the sealing structure
#59Stud bump and package structure thereof and method of manufacturing the same
#60Joining method, method for producing electronic device and electronic part
#61Method for mounting a semiconductor chip on a carrier
#62Method of fabricating a light emitting diode display with integrated defect detection test
#63Light emitting device
#64Stacked type power device module
#65Semiconductor chip, method for producing a semiconductor chip and method for soldering a semiconductor chip to a carrier
#66Mounted structure
#67Electric device package comprising a laminate and method of making an electric device package comprising a laminate
#68Methods for producing a bond and a semiconductor module
#69METHOD FOR BONDING LED WAFER, METHOD FOR MANUFACTURING LED CHIP AND BONDING STRUCTURE
#70Module including a discrete device mounted on a DCB substrate
#71Method for producing a power semiconductor arrangement
#72Semiconductor device including diffusion soldered layer on sintered silver layer
#73Method of Forming a Bonded Structure
#74Method for manufacturing wafer-bonded semiconductor device
#75Power semiconductor chip having two metal layers on one face
#76Semiconductor device including a contact clip having protrusions and manufacturing thereof
#77BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS
#78Semiconductor device including excess solder
#79Device and method including a soldering process
#80Method for processing a semiconductor wafer or die, and particle deposition device
#81Method for mounting a semiconductor chip on a carrier
#82Semiconductor module
#83LEAD-FREE HIGH TEMPERATURE COMPOUND
#84Semiconductor module and method for production thereof
#85Method of making an electronic device
#86Method and package for circuit chip packaging
#87Method and system for forming a thin semiconductor device
#88Dry flux bonding device and method
#89Composite solder alloy preform
#90Stacked semiconductor chips with separate encapsulations
#91Electronic device package and method for fabricating the same
#92Semiconductor device
#93Nickel tin bonding system with barrier layer for semiconductor wafers and devices
#94Power semiconductor module and method for operating a power semiconductor module
#95Method of fabricating a high-temperature compatible power semiconductor module
#96Method and package for circuit chip packaging
#97Packaged semiconductor chips
#98Module having a stacked magnetic device and semiconductor device and method of forming the same
#99High temperature, stable SiC device interconnects and packages having low thermal resistance
#100Selective solder stop
#101Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer
#102Stacked semiconductor chips with separate encapsulations
#103Module including a rough solder joint
#104Device and method including a soldering process
#105Electronic device
#106Semiconductor device
#107Electronic component with buffer layer
#108Semiconductor device with semiconductor chip and method for producing it
#109Semiconductor device including semiconductor chips having contact elements
#110Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier
#111Semiconductor device comprising a semiconductor chip stack and method for producing the same
#112Semiconductor module including semiconductor chips coupled to external contact elements
#113Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip
#114Semiconductor module with multiple semiconductor chips
#115High temperature, stable SiC device interconnects and packages having low thermal resistance
#116Nickel tin bonding system with barrier layer for semiconductor wafers and devices
#117Materials for use with interconnects of electrical devices and related methods
#118Packaged semiconductor chips
#119Semiconductor chip, semiconductor device and methods for producing the same
#120Electronic assemblies having a low processing temperature
#121Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film
#122Diffusion soldered semiconductor device
#123Electronic module with switching functions and method for producing the same
#124Nickel tin bonding system for semiconductor wafers and devices
#125Method of producing an electronic component
#126Vertical semiconductor power switch, electronic component and methods of producing the same
#127Integrating a heat spreader with an interface material having reduced void size
#128Power semiconductor device and method for producing it
#129Substrate and method for mounting silicon device
#130Electronic module with stacked semiconductors
#131Power semiconductor component having chip stack
#132Electronic component and method for its assembly
#133Vertical power semiconductor component, semiconductor device and methods for the production thereof
#134Semiconductor device comprising a vertical semiconductor component and method for producing the same
#135Method for the planar joining of components of semiconductor devices and a diffusion joining structure
#136Electronic module and method of assembling the same
#137Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure
#138Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor
#139Integrated heat spreader and method for using
#140Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment
#141Semiconductor device and manufacturing method thereof
#142High temperature, stable SiC device interconnects and packages having low thermal resistance
#143Electronic assemblies having a low processing temperature
#144Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
#145Diffusion solder position, and process for producing it