211362 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester; Hardening the adhesive by curing, i.e. thermosetting Microwave curing
Electronics package having a self-aligning interconnect assembly and method of making same
#2Electronics package with integrated interconnect structure and method of manufacturing thereof
#3Electronics package having a multi-thickness conductor layer and method of manufacturing thereof
#4Electrical interconnect structure for an embedded electronics package
#5Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof
#6Microelectronic devices and methods for manufacturing microelectronic devices
#7Methods of fabricating electronics assemblies
#8Semiconductor device package
#9Microwave Cure of Semiconductor Devices
#10Microelectronic devices and methods for manufacturing microelectronic devices
#11Apparatus incorporating small-feature-size and large-feature-size components and method for making same