H01L2224/8388 - CPC Classification Index

ClassID:

211367 ⎘

H01L2224/8388 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives

Recent Application in this class:

20240203754

2024-06-20

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT ASSEMBLY AND AN INTEGRATED CIRCUIT FORMED THEREFROM

20230395463

2023-12-07

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS

20230207573

2023-06-29

DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING THE SAME

20230017939

2023-01-19

Semiconductor device and a method of manufacturing thereof

20220384674

2022-12-01

METHOD OF MANUFACTURING ELECTRIC DEVICE

20220013434

2022-01-13

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

20210151405

2021-05-20

Semiconductor device and a method of manufacturing thereof

20200227371

2020-07-16

Semiconductor device and a method of manufacturing thereof

20190252338

2019-08-15

Semiconductor devices and semiconductor devices including a redistribution layer

#10

20190229071

2019-07-25

Semiconductor package

#11

20190109111

2019-04-11

Semiconductor device and a method of manufacturing thereof

#12

20190080942

2019-03-14

Chip packaging apparatus and method thereof

#13

20190048238

2019-02-14

A-staged thermoplastic-polyimide (TPI) adhesive compound containing flat inorganic particle fillers and method of use

#14

20190035762

2019-01-31

Method of manufacturing semiconductor device

#15

20180346777

2018-12-06

A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use

#16

20180240775

2018-08-23

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

#17

20180130766

2018-05-10

3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix

#18

20170358547

2017-12-14

Semiconductor devices including conductive pillars

#19

20170271290

2017-09-21

Semiconductor device and a method of manufacturing thereof

#20

20170013722

2017-01-12

Anisotropic conductive film and method for manufacturing the same

#21

20160333238

2016-11-17

A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use

#22

20160225731

2016-08-04

Methods of forming conductive materials on semiconductor devices, and methods of forming electrical interconnects

#23

20160174371

2016-06-16

Method for making electronic device with cover layer with openings and related devices

#24

20160155862

2016-06-02

Methods of manufacturing a semiconductor device

#25

20160020194

2016-01-21

Electronic sub-assembly and method for the production of an electronic sub-assembly

#26

20160013173

2016-01-14

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

#27

20150049450

2015-02-19

Electronic device and method of manufacturing electronic device

#28

20150009644

2015-01-08

Method for making electronic device with cover layer with openings and related devices

#29

20140159229

2014-06-12

Semiconductor device connected by anisotropic conductive film

#30

20130299986

2013-11-14

Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages

#31

20130249117

2013-09-26

Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof

#32

20120295400

2012-11-22

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

#33

20120244666

2012-09-27

Printed substrate manufacturing equipment and manufacturing method

#34

20120097335

2012-04-26

Method and system for bonding electrical devices using an electrically conductive adhesive

#35

20120028419

2012-02-02

Semiconductor device and manufacturing method thereof

#36

20110318879

2011-12-29

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

#37

20110201195

2011-08-18

Flip chip mounting method and bump forming method

#38

20110193244

2011-08-11

ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE

#39

20110149540

2011-06-23

Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element

#40

20110140264

2011-06-16

Semiconductor device and manufacturing method thereof

#41

20110115062

2011-05-19

Semiconductor device and method of manufacturing the same

#42

20110045640

2011-02-24

Method and system for bonding electrical devices using an electrically conductive adhesive

#43

20110037174

2011-02-17

Method of manufacturing semiconductor component, and semiconductor component

#44

20100320620

2010-12-23

Adhesive film for semiconductor and semiconductor device using the adhesive film

#45

20100311227

2010-12-09

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

#46

20100307805

2010-12-09

CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME

#47

20100267199

2010-10-21

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

#48

20100224972

2010-09-09

Leadless integrated circuit package having standoff contacts and die attach pad

#49

20100224970

2010-09-09

Leadless integrated circuit package having standoff contacts and die attach pad

#50

20100203675

2010-08-12

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

#51

20100197080

2010-08-05

Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method

#52

20100186894

2010-07-29

Method for packing electric components on a substrate

#53

20100178501

2010-07-15

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME

#54

20100093154

2010-04-15

Dicing/die bonding film

#55

20100071946

2010-03-25

Electronic component mounting structure

#56

20100025844

2010-02-04

Semiconductor device and manufacturing method thereof

#57

20100019365

2010-01-28

DICING/DIE BONDING FILM

#58

20090236757

2009-09-24

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING

#59

20090200522

2009-08-13

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

#60

20090126876

2009-05-21

Flip chip mounting method and method for connecting substrates

#61

20090124044

2009-05-14

Method for removing bubbles from adhesive layer of semiconductor chip package

#62

20090117688

2009-05-07

Flip chip mounting method and bump forming method

#63

20090115071

2009-05-07

Flip chip mounting method and method for connecting substrates

#64

20090111222

2009-04-30

SEMICONDUCTOR CHIP MOUNTING METHOD, SEMICONDUCTOR MOUNTING WIRING BOARD PRODUCING METHOD AND SEMICONDUCTOR MOUNTING WIRING BOARD

#65

20090110845

2009-04-30

METHODS FOR BONDING HIGH TEMPERATURE SENSORS

#66

20090102028

2009-04-23

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

#67

20090045525

2009-02-19

Semiconductor element and semiconductor device

#68

20090023245

2009-01-22

Flip chip mounting method and bump forming method

#69

20090014498

2009-01-15

COMPRESSION BONDING DEVICE

#70

20090008800

2009-01-08

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

#71

20090001611

2009-01-01

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD

#72

20080284046

2008-11-20

Flip chip mounting method and bump forming method

#73

20080217793

2008-09-11

Method and device including reworkable alpha particle barrier and corrosion barrier

#74

20080217765

2008-09-11

Semiconductor component and method of manufacture

#75

20080191220

2008-08-14

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

#76

20080145668

2008-06-19

Adhesive film composition, associated dicing die bonding film, and die package

#77

20080136045

2008-06-12

Stacked die in die BGA package

#78

20080128664

2008-06-05

Flip-chip mounting resin composition and bump forming resin composition

#79

20080096316

2008-04-24

Stacked die with a recess in a die BGA package

#80

20080032449

2008-02-07

Method of fabricating a stacked die having a recess in a die BGA package

#81

20080017967

2008-01-24

Electronic circuit in a package-on-package configuration and method for producing the same

#82

20080007890

2008-01-10

Thermally conductive composite and uses for microelectronic packaging

#83

20070284034

2007-12-13

Resonating conductive traces and methods of using same for bonding components

#84

20070278683

2007-12-06

Interlayer dielectric and pre-applied die attach adhesive materials

#85

20070257362

2007-11-08

Process for forming bumps and solder bump

#86

20070216023

2007-09-20

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

#87