H01L2224/839 - CPC Classification Index

ClassID:

211381 ⎘

H01L2224/839 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector with the layer connector not providing any mechanical bonding

Sub-classes:

H01L2224/83901 » Pressing the layer connector against the bonding areas by means of another connector 4

Recent Application in this class:

20150206807

2015-07-23

Semiconductor device and manufacturing method thereof

20100171097

2010-07-08

Detection device and method for manufacturing the same

20060131712

2006-06-22

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component

20050201062

2005-09-15

Apparatus and method for attaching a heat sink to an integrated circuit module