Patents-Review.com
ClassID:

211616 ⎘

H01L2224/85148 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Aligning involving movement of a part of the bonding apparatus

Sub-classes:
Recent Application in this class:
#1
20160056124
2016-02-25

Method of manufacturing semiconductor device

 #2
20140363926
2014-12-11

Semiconductor device and method for manufacturing the same

 #3
20140127860
2014-05-08

Method of manufacturing semiconductor device

 #4
20130171776
2013-07-04

Semiconductor device and method for manufacturing the same

 #5
20130005086
2013-01-03

Method of manufacturing semiconductor device

 #6
20120139129
2012-06-07

Wire bonding method and semiconductor device

 #7
20110171777
2011-07-14

Method of manufacturing semiconductor device

 #8
20110114704
2011-05-19

Bonding apparatus and bonding method

 #9
20110101544
2011-05-05

Semiconductor device and method for manufacturing the same

 #10
20110070729
2011-03-24

Method of manufacturing semiconductor device

 #11
20110062216
2011-03-17

Method for manufacturing semiconductor device and bonding apparatus

 #12
20100255639
2010-10-07

Method of manufacturing a semiconductor device including plural semiconductor chips

 #13
20100230471
2010-09-16

BONDING METHOD AND BONDING DEVICE

 #14
20100207280
2010-08-19

Wire bonding method and semiconductor device

 #15
20100187690
2010-07-29

SEMICONDUCTOR DEVICE

 #16
20100181367
2010-07-22

Wire bonding apparatus and wire bonding method

 #17
20100096437
2010-04-22

Wire bonding method

 #18
20100084773
2010-04-08

Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate

 #19
20090321926
2009-12-31

Mounting structure and mounting method

 #20
20090315192
2009-12-24

Semiconductor device including semiconductor chip and sealing material

 #21
20090278265
2009-11-12

Resin sealing structure for electronic component and resin sealing method for electronic component

 #22
20090166774
2009-07-02

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

 #23
20090061563
2009-03-05

Method of manufacturing a semiconductor device including plural semiconductor chips

 #24
20080304245
2008-12-11

SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES ON A SUBSTRATE

 #25
20080099532
2008-05-01

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

 #26
20080038872
2008-02-14

Method of manufacturing semiconductor device

 #27
20070182026
2007-08-09

Semiconductor device

 #28
20070048903
2007-03-01

Multi-chip package type semiconductor device

 #29
20070035017
2007-02-15

Multi-chip semiconductor device package

 #30
20060021434
2006-02-02

Electronic device and angular velocity detector

 #31
20050230793
2005-10-20

Semiconductor device

 #32
20050194422
2005-09-08

Bump bonding apparatus and bump bonding method

 #33
20050179730
2005-08-18

Thermal head and bonding connection method therefor

 #34
20050029679
2005-02-10

Semiconductor device and wire bonding apparatus