211625 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Applying energy for connecting; Compression bonding Thermocompression bonding
METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION
#302System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
#303Semiconductor device and manufacturing method thereof
#304Semiconductor device and a method of manufacturing the same
#305Roughened bonding pad and bonding wire surfaces for low pressure wire bonding
#306Wire bonding process for copper-metallized integrated circuits
#307Apparatus and method for low pressure wirebond
#308Semiconductor component and production method suitable therefor
#309Self-locking wire bond structure and method of making the same
#310Wirebonding insulated wire and capillary therefor
#311Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors
#312Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads
#313Semiconductor device structural body and electronic device
#314Method of manufacturing a semiconductor device
#315System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
#316Semiconductor wire bonding machine cleaning device and method