ClassID:

211637

H01L2224/85238 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Applying energy for connecting using electric resistance welding, i.e. ohmic heating

Recent Application in this class: