H01L2224/85379 - CPC Classification Index

ClassID:

211645 ⎘

H01L2224/85379 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding interfaces of the semiconductor or solid state body Material

Recent Application in this class:

20230110402

2023-04-13

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

20210366867

2021-11-25

Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor device

20180047697

2018-02-15

CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION