H01L2224/921 - CPC Classification Index

ClassID:

211831 ⎘

H01L2224/921 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups - ; Specific sequence of method steps Connecting a surface with connectors of different types

Sub-classes:

H01L2224/9211 » Parallel connecting processes 430
H01L2224/9212 » Sequential connecting processes 116

Recent Application in this class:

20200152599

Method of manufacturing semiconductor structure

20190115313

Method of manufacturing semiconductor structure

20180166421

Package on-package structure with epoxy flux residue

20180047701

Method of manufacturing semiconductor structure

20170345794

Package-on-package structure with epoxy flux residue

20170317016

Package with vertical interconnect between carrier and clip

20160365332

Semiconductor structure and manufacturing method thereof

20150348859

Underfill material and method for manufacturing semiconductor device using the same

20130344660

Heatsink attachment module

20130105994

Heatsink attachment module

20120252166

Semiconductor device manufacturing apparatus and method for manufacturing semiconductor device

20120205796

Semiconductor package and method for manufacturing the same

20120021563

Method and apparatus for manufacturing three-dimensional integrated circuit

20100159644

LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM