H01L2224/922 - CPC Classification Index

ClassID:

211866 ⎘

H01L2224/922 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups - ; Specific sequence of method steps Connecting different surfaces of the semiconductor or solid-state body with connectors of different types

Sub-classes:

H01L2224/9221 » Parallel connecting processes 54
H01L2224/9222 » Sequential connecting processes 165

Recent Application in this class:

20240429116

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

20200152591

Fabrication method of semiconductor package with stacked semiconductor chips

20180261563

Fabrication method of semiconductor package with stacked semiconductor chips

20160260651

Semiconductor device

20140353766

Small footprint semiconductor package

20130299961

Semiconductor package with stacked semiconductor chips

20120175757

Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus

20110074012

Substrate with built-in semiconductor element, and method of fabricating substrate with built-in semiconductor element