H01L2224/95091 - CPC Classification Index

ClassID:

211889 ⎘

H01L2224/95091 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips; Bonding environment Under pressure

Sub-classes:

H01L2224/95092 » Atmospheric pressure e.g. dry self-assembly 21
H01L2224/95093 » Transient conditions, e.g. assisted by a gas flow or a liquid flow 4

Recent Application in this class:

20230361074

LOW TEMPERATURE DIRECT BONDING

20230197669

Methods and systems for manufacturing semiconductor devices

20220415698

APPARATUS AND METHOD FOR TRANSFERRING LIGHT-EMITTING DIODES

20210296228

Semiconductor package

20210091037

Methods and systems for manufacturing semiconductor devices

20210074671

Methods and systems for manufacturing semiconductor devices

20200212000

Methods and systems for manufacturing semiconductor devices

20200211999

Methods and systems for manufacturing semiconductor devices

20180114772

Method for simultaneously bonding multiple chips of different heights on flexible substrates using anisotropic conductive film or paste

20160043054

Batch process for connecting chips to a carrier

18882721

Power semiconductor apparatus and bonding method thereof