207564 ⎘
Details of semiconductor or other solid state devices; Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
LAMINATE PACKAGE LID TO PREVENT DELAMINATION
#2SEMICONDUCTOR MODULE AND A METHOD FOR FORMING THE SAME
#3ENHANCED VIDEO BANDWIDTH DEVICE PACKAGES
#4Integrated Circuit Cooling Utilizing Wire Bonding On Metallized Layer
#5SMALL FOOTPRINT POWER SWITCH
#6METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THE SAME
#7SEMICONDUCTOR DEVICE
#8STRUCTURAL ENCLOSURE FOR PROTECTION AGAINST FOREIGN OBJECT DEBRIS
#9Electronic Device Having a Supply Terminal and a Thermal Bridge
#10SMALL FOOTPRINT POWER SWITCH
#11SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THEREFOR
#12THREE-DIMENSIONAL (3D) PACKAGES AND METHODS FOR 3D PACKAGING
#13PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHODS OF FORMING THE SAME
#14SEMICONDUCTOR DEVICE
#15PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FINS AND METHODS OF FORMING THE SAME
#16HERMETIC MICROELECTRONIC MODULE USING A SHEATH
#17HOUSING, SEMICONDUCTOR MODULE INCLUDING A HOUSING, AND METHOD FOR ASSEMBLING A SEMICONDUCTOR MODULE
#18HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
#19SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#20POWER MODULE UTILIZING INJECTABLE CONDUCTIVE COMPONENT FOR DIRECT COOLING
#21SEMICONDUCTOR PACKAGE
#22SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR
#23CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
#24PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT
#25CURRENT SENSOR WITH INVERTED SHIELDING ELEMENT
#26SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR
#27CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
#28Embedded chip package and manufacturing method thereof
#29TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
#30Semiconductor device
#31Protector cap for package with thermal interface material
#32SURFACE MOUNTABLE OPTOELECTRONIC DEVICE WITH SIDE WALLS INCLUDING SLOTS FILLED WITH A LAMINATED ENCAPSULANT MATERIAL
#33Semiconductor apparatus
#34SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#35SEMICONDUCTOR APPARATUS AND VEHICLE
#36CHIP DEVICE
#37Embedded chip package and manufacturing method thereof
#38Semiconductor device package with semiconductive thermal pedestal
#39Semiconductor package including conductive crack preventing layer
#40SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF
#41SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
#42Semiconductor package structure and methods of manufacturing the same
#43Semiconductor package
#44Circuit structure and electrical junction box
#45Semiconductor device
#46POWER MODULE HOUSING WITH IMPROVED PROTRUSION DESIGN
#47Protector cap for package with thermal interface material
#48Semiconductor device and amplifier having bonding wire and conductive member
#49Semiconductor module
#50Semiconductor package
#51Semiconductor device comprising sealing frame configured as a conductor
#52Hermetically sealed optically transparent wafer-level packages and methods for making the same
#53Semiconductor power module and power conversion device
#54Semiconductor package
#55Substrate bonding structure and substrate bonding method
#56Semiconductor device and manufacturing method thereof
#57Semiconductor package with elastic coupler and related methods
#58Semiconductor device
#59Semiconductor apparatus and method for manufacturing same
#60Semiconductor package
#61Serially connected computing nodes in a distributed computing system
#62Semiconductor package
#63Semiconductor package with elastic coupler and related methods
#64Solid-state storage device
#65Packaged power device having improved heat dissipation capacity and better thermal performances
#66TIM strain mitigation in electronic modules
#67Semiconductor device and method for manufacturing semiconductor device
#68Semiconductor module
#69Lead package and method for minimizing deflection in microelectronic packaging
#70Power semiconductor device and method of manufacturing the same, and power conversion device
#71Semiconductor device and method of manufacturing semiconductor device
#72Power semiconductor module with heat dissipation plate
#73Distributed computing
#74Semiconductor device and method of manufacturing semiconductor device
#75Case, semiconductor device and manufacturing method of case
#76Resin molding and sensor device
#77Semiconductor device
#78TIM strain mitigation in electronic modules
#79Low stress integrated device packages
#80Semiconductor module
#81Lens cap for a transistor outline package
#82Semiconductor package with elastic coupler and related methods
#83ELECTRONIC DEVICE, ALTIMETER, ELECTRONIC APPARATUS, AND MOVING OBJECT
#84SEMICONDUCTOR MODULE
#85Semiconductor module
#86Use of an external getter to reduce package pressure
#87IC die, ultrasound probe, ultrasonic diagnostic system and method
#88TIM strain mitigation in electronic modules
#89Package structure with an elastomer with lower elastic modulus
#90Semiconductor package with elastic coupler and related methods
#91Element-accommodating package and mounting structure
#92Semiconductor package with multi-section conductive carrier
#93SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS
#94Sleep mode initialization in a distributed computing system
#95Packaged assembly for high density power applications
#96Semiconductor device packaging with reduced size and delamination
#97Power semiconductor package with multi-section conductive carrier
#98Fingerprint module and manufacturing method for same
#99Tim strain mitigation in electronic modules
#100Semiconductor device component and semiconductor device
#101Method for manufacturing semiconductor device and semiconductor device
#102Vertical mount package and wafer level packaging therefor
#103Semiconductor device
#104Electronic assembly with detachable components
#105Integrated circuit arrangement in a distributed computing system
#106Vertical mount package and wafer level packaging therefor
#107Vertical MOSFET device
#108Microelectronic assembly with an embedded waveguide adapter and method for forming the same
#109Semiconductor package device with cavity structure and the packaging method thereof
#110Semiconductor device and fabrication mehtod of the semiconductor device
#111Vertical MOSFET with through-body via for gate
#112Microelectronic assembly with an embedded waveguide adapter and method for forming the same
#113SUSPENDED LEAD FRAME ELECTRONIC PACKAGE
#114Distributed computing
#115Method and apparatus for selectively placing components into a sleep mode in response to loss of one or more clock signals or receiving a command to enter sleep mode
#116Distributed computing
#117Distributed computing
#118Distributed computing
#119Power semiconductor module comprising a connection device with internal contact spring connection elements
#120Power semiconductor device
#121Electronic device and method for fabricating the same
#122Vertical MOSFET with through-body via for gate
#123Semiconductor device having hermitically sealed active area and electrodes
#124Semiconductor module with switching components and driver electronics
#125Packaged micro movable device and method for making the same
#126Semiconductor sensor having a flat mounting plate with banks
#127HERMETIC SEALING OF MICRO DEVICES
#128METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION UTILIZING FORCED AIR
#129Sealed electronic component
#130Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components
#131Electronic assembly with detachable components
#132Rectifier diode of electric generator
#133Chip-scale package
#134Electronic device and method for fabricating the same
#135Semiconductor device with reduced contact resistance
#136Semiconductor device with reduced contact resistance
#137Flip chip substrate design
#138Semiconductor packages and methods for manufacturing the same