207566 ⎘
Details of semiconductor or other solid state devices; Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
POWER SEMICONDUCTOR MODULE WITH SHIELDING HEAT SINK
#2HEADER FOR SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
#3Device having closed space between overlapping sealing members
#4Stem for semiconductor package
#5ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE
#6Component and method for producing a component
#7Discrete power transistor package having solderless DBC to leadframe attach
#8Hermetically sealed electronic packages with electrically powered multi-pin electrical feedthroughs
#9Semiconductor device, power converter, and method of manufacturing semiconductor device
#10Method of manufacturing a semiconductor device
#11Base body with soldered-on ground pin, method for its production and uses thereof
#12SMD package with top side cooling
#13Semiconductor device and method of manufacturing the semiconductor device
#14Semiconductor structure and fabrication method thereof
#15Electronic component mounting package and electronic device using the same
#16Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same
#17High-frequency module
#18Power semiconductor module, method for manufacturing the same, and power converter
#19High-frequency module
#20High-frequency semiconductor package and high-frequency semiconductor device
#21Nitride semiconductor light-emitting system
#22Transistor outline housing and method for producing same
#23Housing for a semiconductor chip and semiconductor chip with a housing
#24Electronic component mounting package and electronic apparatus using the same
#25DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAME ATTACH
#26Electrical feedthrough assembly
#27Semiconductor module
#28Semiconductor module
#29Electronic component mounting device and method for producing the same
#30Semiconductor equipment and method of manufacturing the same
#31Microwave circuit package
#32Base design for self-centering
#33Flange package for a semiconductor device
#34Electronic component package
#35Sealing board and method for producing the same
#36Integrated Circuit Package with Passive Component
#37Electronic component package and method of manufacturing the same, and electronic component device
#38Non-uniform feedthrough and lead configuration for a transistor outline package
#39High-heat-resistive semiconductor device
#40SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE
#41Microwave surface mount hermetically sealed package and method of forming the same
#42SEMICONDUCTOR DEVICE PACKAGE
#43Optical module
#44Highly Heat-Resistant Synthetic Polymer Compound and High Withstand Voltage Semiconductor Device
#45Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#46Base design for self-centering
#47Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#48Hermetic MEMS package and method of manufacture
#49Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#50Compliant interconnects for semiconductors and micromachines
#51Semiconductor device package
#52Surface mount hermetic package for power semiconductor die
#53Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#54Semiconductor package and method for manufacturing the same
#55Method of making a hybrid housing and hybrid housing
#56Housing assembly and memory device