Patents-Review.com
ClassID:

207568 ⎘

H01L23/049 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base

Recent Application in this class:
#1
20260060059
2026-02-26

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

 #2
20260047177
2026-02-12

SEMICONDUCTOR DEVICE

 #3
20260011656
2026-01-08

POWER SEMICONDUCTOR MODULE WITH SHIELDING HEAT SINK

 #4
20260011625
2026-01-08

SEMICONDUCTOR DEVICE

 #5
20250391727
2025-12-25

SEMICONDUCTOR DEVICE

 #6
20250385143
2025-12-18

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

 #7
20250357433
2025-11-20

SEMICONDUCTOR DEVICE

 #8
20250259968
2025-08-14

SEMICONDUCTOR MODULE AND VEHICLE

 #9
20250157863
2025-05-15

POWER MODULE

 #10
20250105070
2025-03-27

POWER MODULE AND POWER CONVERSION DEVICE

 #11
20250022762
2025-01-16

SEMICONDUCTOR MODULE

 #12
20250014951
2025-01-09

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

 #13
20240332271
2024-10-03

SEMICONDUCTOR DEVICE

 #14
20240178081
2024-05-30

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #15
20230411229
2023-12-21

SEMICONDUCTOR DEVICE

 #16
20230402432
2023-12-14

SEMICONDUCTOR DEVICE

 #17
20230402332
2023-12-14

Compartment Shielding With Metal Frame and Cap

 #18
20230369175
2023-11-16

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE SAME

 #19
20230369142
2023-11-16

SEMICONDUCTOR DEVICE AND METHOD FOR DETERMINING DETERIORATION OF SEMICONDUCTOR DEVICE

 #20
20230317560
2023-10-05

POWER SEMICONDUCTOR MODULE, SYSTEM INCLUDING A POWER SEMICONDUCTOR MODULE AND A COOLER AND METHOD FOR FABRICATING A SYSTEM

 #21
20230317534
2023-10-05

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE

 #22
20230268239
2023-08-24

SEMICONDUCTOR DEVICE, POWER CONVERTER, AND MOVING VEHICLE

 #23
20230260951
2023-08-17

SEMICONDUCTOR APPARATUS AND VEHICLE

 #24
20230231487
2023-07-20

SEMICONDUCTOR DEVICE, BUSBAR, AND POWER CONVERTER

 #25
20230197691
2023-06-22

SEMICONDUCTOR POWER MODULE AND POWER CONVERSION APPARATUS

 #26
20230197539
2023-06-22

Interposer chips and enclosures for quantum circuits

 #27
20230188074
2023-06-15

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR CHIP

 #28
20230146272
2023-05-11

SEMICONDUCTOR APPARATUS

 #29
20230140664
2023-05-04

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

 #30
20230098854
2023-03-30

SEMICONDUCTOR DEVICE

 #31
20230092403
2023-03-23

Semiconductor device with spaced apart containers

 #32
20230071960
2023-03-09

Compartment shielding with metal frame and cap

 #33
20230058727
2023-02-23

SEMICONDUCTOR DEVICE

 #34
20220415729
2022-12-29

SEMICONDUCTOR MODULE

 #35
20220359342
2022-11-10

SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES

 #36
20220302075
2022-09-22

POWER SEMICONDUCTOR MODULE

 #37
20220301955
2022-09-22

Semiconductor device

 #38
20220238459
2022-07-28

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE AND MOVING BODY

 #39
20220230929
2022-07-21

Semiconductor module

 #40
20220223546
2022-07-14

SEMICONDUCTOR DEVICE AND POWER CONVERTER

 #41
20220181272
2022-06-09

Stem for semiconductor package

 #42
20220172971
2022-06-02

Hermetically sealed housing with a semiconductor component and method for manufacturing thereof

 #43
20220165631
2022-05-26

Integrally bonded semiconductor device and power converter including the same

 #44
20220157672
2022-05-19

Semiconductor apparatus and manufacturing method of semiconductor apparatus

 #45
20220134616
2022-05-05

Manufacturing method of housing for semiconductor device

 #46
20220108977
2022-04-07

Semiconductor device

 #47
20220102312
2022-03-31

Semiconductor device

 #48
20220093572
2022-03-24

Semiconductor device

 #49
20220068789
2022-03-03

Package, method for forming a package, carrier tape, chip card and method for forming a carrier tape

 #50
20210366796
2021-11-25

Semiconductor device

 #51
20210296189
2021-09-23

Case with a plurality of pair case components for a semiconductor device

 #52
20210257268
2021-08-19

Semiconductor module

 #53
20210210404
2021-07-08

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

 #54
20210202330
2021-07-01

Semiconductor device including surface pressure absorbing member for fastening heat sink

 #55
20210134762
2021-05-06

Semiconductor device

 #56
20210134686
2021-05-06

Power semiconductor device including press-fit connection terminal

 #57
20210134607
2021-05-06

Methods for manufacturing a semiconductor device

 #58
20210082778
2021-03-18

Power semiconductor module and power conversion apparatus

 #59
20210066146
2021-03-04

Semiconductor device and semiconductor device manufacturing method

 #60
20210043605
2021-02-11

Semiconductor module arrangement

 #61
20210036597
2021-02-04

Semiconductor module arrangement with fast switching, reduced losses, and low voltage overshoot and method for operating the same

 #62
20210028078
2021-01-28

Semiconductor module arrangement

 #63
20200395255
2020-12-17

Semiconductor device

 #64
20200381317
2020-12-03

Vehicle power conversion device

 #65
20200328178
2020-10-15

Semiconductor device and method for manufacturing semiconductor device

 #66
20200328130
2020-10-15

Semiconductor device and semiconductor device manufacturing method

 #67
20200273760
2020-08-27

Semiconductor module

 #68
20200118903
2020-04-16

Semiconductor device

 #69
20200052420
2020-02-13

Semiconductor apparatus

 #70
20190363043
2019-11-28

Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making

 #71
20190326877
2019-10-24

Electronic component housing package, electronic apparatus, and electronic module

 #72
20190304867
2019-10-03

Semiconductor apparatus

 #73
20190304857
2019-10-03

Power Semiconductor Device Module Having Mechanical Corner Press-Fit Anchors

 #74
20190252292
2019-08-15

Power module and semiconductor apparatus

 #75
20190228985
2019-07-25

Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereof

 #76
20190206751
2019-07-04

Semiconducter device with filler to suppress generation of air bubbles and electric power converter

 #77
20190164858
2019-05-30

Semiconductor apparatus and electric power conversion apparatus

 #78
20190131154
2019-05-02

Hermetically sealed housing with a semiconductor component and method for manufacturing thereof

 #79
20190109059
2019-04-11

Semiconductor device

 #80
20180375017
2018-12-27

Magneto-resistive chip package including shielding structure

 #81
20180358949
2018-12-13

Electronic component housing package, electronic apparatus, and electronic module

 #82
20180315721
2018-11-01

Radio frequency circuit, wireless communication device, and method of manufacturing radio frequency circuit

 #83
20180204782
2018-07-19

Semiconductor device and method of manufacturing the same

 #84
20180182716
2018-06-28

Semiconductor device and power electronics apparatus

 #85
20180182679
2018-06-28

Case having terminal insertion portion for an external connection terminal

 #86
20180145003
2018-05-24

Electronic component mounting package and electronic device using the same

 #87
20170365518
2017-12-21

SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS

 #88
20170359906
2017-12-14

Electronic device

 #89
20170316993
2017-11-02

Power semiconductor device module having mechanical corner press-fit anchors

 #90
20170316992
2017-11-02

Power semiconductor device module having mechanical corner press-fit anchors

 #91
20170301594
2017-10-19

Semiconductor module

 #92
20170287729
2017-10-05

Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereof

 #93
20170271273
2017-09-21

Semiconductor device having a resin case with a notch groove

 #94
20170263587
2017-09-14

Semiconductor device with metal patterns having convex and concave sides

 #95
20170236819
2017-08-17

Semiconductor device and manufacturing method

 #96
20170229389
2017-08-10

Semiconductor device

 #97
20170221785
2017-08-03

Power semiconductor module having a pressure application body and arrangement therewith

 #98
20170077005
2017-03-16

Semiconductor device

 #99
20170063071
2017-03-02

Semiconductor device, intelligent power module and power conversion apparatus

 #100
20160358895
2016-12-08

Power semiconductor module

 #101
20160353590
2016-12-01

Low profile, highly configurable, current sharing paralleled wide band gap power device power module

 #102
20160322562
2016-11-03

Magneto-resistive chip package including shielding structure

 #103
20160307817
2016-10-20

Power semiconductor module comprising a case, base plate, and spacer

 #104
20160288259
2016-10-06

Laser welding method

 #105
20160254255
2016-09-01

Power semiconductor module and composite module

 #106
20160126187
2016-05-05

Semiconductor device

 #107
20160093589
2016-03-31

Power module with a plurality of patterns with convex and concave side

 #108
20160049342
2016-02-18

Module arrangement for power semiconductor devices

 #109
20150351276
2015-12-03

Semiconductor device

 #110
20150289356
2015-10-08

Power module

 #111
20150287657
2015-10-08

Solid-state stacked die contactors

 #112
20150279753
2015-10-01

Power semiconductor module

 #113
20150216067
2015-07-30

Low profile, highly configurable, current sharing paralleled wide band gap power device power module

 #114
20150179539
2015-06-25

Laser welding method, laser welding jig, and semiconductor device

 #115
20150170984
2015-06-18

Electronic component can package structure

 #116
20150115288
2015-04-30

Power semiconductor module having pattern laminated region

 #117
20150061105
2015-03-05

Semiconductor module including a terminal embedded in casing wall and bent over thick portion of lid

 #118
20140374896
2014-12-25

Semiconductor device, method for installing heat dissipation member to semiconductor device, and a method for producing semiconductor device

 #119
20140246768
2014-09-04

Semiconductor device and manufacturing method of semiconductor device

 #120
20140233188
2014-08-21

Mounting structure for printed circuit board, and semiconductor device using such structure

 #121
20140225238
2014-08-14

Semiconductor device

 #122
20140210067
2014-07-31

Semiconductor device

 #123
20140198454
2014-07-17

Integrated power module packaging structure

 #124
20140168922
2014-06-19

Semiconductor device

 #125
20140167235
2014-06-19

Semiconductor module

 #126
20140118956
2014-05-01

All-in-one power semiconductor module

 #127
20140035118
2014-02-06

Semiconductor module arrangement and method for producing and operating a semiconductor module arrangement

 #128
20130342999
2013-12-26

Semiconductor module

 #129
20130286618
2013-10-31

Circuit device

 #130
20130286617
2013-10-31

Circuit device

 #131
20130286616
2013-10-31

Circuit device

 #132
20130264697
2013-10-10

Semiconductor device

 #133
20130112994
2013-05-09

Semiconductor module and method for manufacturing semiconductor module

 #134
20130112993
2013-05-09

SEMICONDUCTOR DEVICE AND WIRING SUBSTRATE

 #135
20130105961
2013-05-02

Low inductance power module

 #136
20130069217
2013-03-21

SEMICONDUCTOR DEVICE AND ELECTRODE TERMINAL

 #137
20130069215
2013-03-21

Semiconductor device

 #138
20130049556
2013-02-28

Method of manufacturing a metal housing part

 #139
20120307541
2012-12-06

Power converter, semiconductor device, and method for manufacturing power converter

 #140
20120306091
2012-12-06

Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector

 #141
20120141818
2012-06-07

Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part

 #142
20120028025
2012-02-02

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

 #143
20120001227
2012-01-05

Power semiconductor module

 #144
20110284924
2011-11-24

Semiconductor device, semiconductor unit, and power semiconductor device

 #145
20110217837
2011-09-08

CONNECTING PAD PRODUCING METHOD

 #146
20110210431
2011-09-01

Microwave circuit package

 #147
20110173804
2011-07-21

Method for producing a housing part for a semiconductor module

 #148
20110103024
2011-05-05

Power semiconductor module

 #149
20110089568
2011-04-21

Power semiconductor device and manufacturing method therefor

 #150
20110001244
2011-01-06

Method for producing a power semiconductor module, and power semiconductor module comprising a connection device

 #151
20100294787
2010-11-25

Metal housing part and method for maufacturing the housing part

 #152
20100270515
2010-10-28

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

 #153
20090243089
2009-10-01

Module including a rough solder joint

 #154
20080169566
2008-07-17

Press-Fit Diode Having a Silver-Plated Wire Termination

 #155
20080158822
2008-07-03

Sub-assembly

 #156
20080029875
2008-02-07

Hermetically sealed semiconductor device module

 #157
20070257343
2007-11-08

DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION

 #158
20070105454
2007-05-10

Press-fit power diode

 #159
20060268590
2006-11-30

Rectifier diode of electric generator

 #160
20050230807
2005-10-20

Power semiconductor module

 #161
20050156329
2005-07-21

Semiconductor device by embedded package

 #162
20050082692
2005-04-21

Rectifier diode device

 #163
16549801
2021-12-14

Chip package having a cover with window

 #164
15670556
2019-08-20

Wire harness assembly holding device