207569 ⎘
Details of semiconductor or other solid state devices; Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
SEMICONDUCTOR DEVICE
#2SEMICONDUCTOR DEVICE
#3SEMICONDUCTOR PACKAGE AND RELATED METHODS
#4POWER ELECTRONIC SYSTEM HAVING A POWER SEMICONDUCTOR MODULE AND A CURRENT SENSOR AND POWER SEMICONDUCTOR MODULE
#5SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
#6SEMICONDUCTOR DEVICE
#7SEMICONDUCTOR DEVICE
#8SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
#9LID ASSEMBLY FOR A CHIP PACKAGE
#10SEMICONDUCTOR DEVICE
#11SEMICONDUCTOR DEVICE
#12INTEGRATED CIRCUIT PACKAGE
#13MICROMECHANICAL STRUCTURE WITH BONDED COVER
#14Compartment Shielding With Metal Frame and Cap
#15Insulating substrate and power module using the same
#16SEMICONDUCTOR DEVICE
#17SEMICONDUCTOR DEVICE
#18SEMICONDUCTOR DEVICE WITH STACKED TERMINALS
#19Compartment shielding with metal frame and cap
#20ELECTRIC POWER MODULE
#21MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#22Power semiconductor device
#23Press-pack semiconductor fixtures
#24SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES
#25Power semiconductor device with free-floating packaging concept
#26Semiconductor package and related methods
#27Silicon heat-dissipation package for compact electronic devices
#28Microelectromechanical structure with bonded cover
#29Heterogenous integration for RF, microwave and MM wave systems in photoactive glass substrates
#30Low parasitic inductance power module and double-faced heat-dissipation low parasitic inductance power module
#31Power switching module and electronic power device integrating said module
#32Method for manufacturing a three dimensional power module
#33SEMICONDUCTOR DEVICE
#34Wafer accommodation container
#35Encapsulated microelectromechanical structure
#36Semiconductor module
#37Semiconductor switching device
#38Power semiconductor module with short circuit failure mode
#39Power semiconductor device with active short circuit failure mode
#40Semiconductor package and related methods
#41Semiconductor power module comprising graphene
#42Semiconductor module
#43Semiconductor device
#44Semiconductor device
#45Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereof
#46Semiconductor device
#47Silicon heat-dissipation package for compact electronic devices
#48Semiconductor module
#49Power chip integration module, manufacturing method thereof, and double-sided cooling power module package
#50Semiconductor device
#51Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals
#52Semiconductor device
#53Alternator assembly having a gated diode arranged in a load path between an input terminal and an output terminal
#54Semiconductor device including conductive spacer with small linear coefficient
#55Semiconductor device
#56Encapsulated microelectromechanical structure
#57Power module and power conversion system including same
#58Electronic component device
#59Magneto-resistive chip package including shielding structure
#60Semiconductor device
#61Relating to power semiconductor modules
#62Electronic device
#63Power semiconductor device and power semiconductor core module
#64Semiconductor device, manufacturing method for semiconductor device, and electrode plate
#65Diode having a plate-shaped semiconductor element
#66Semiconductor device
#67Semiconductor structure and fabrication method thereof
#68Semiconductor device
#69Semiconductor device with plated lead frame
#70Encapsulated microelectromechanical structure
#71Sealing cap for electronic component
#72Power electronic switching device and power semiconductor module therewith
#73High voltage power electronics module for subsea applications under high hydrostatic pressure and temperature variations
#74Power module
#75Signal block and double-faced cooling power module using the same
#76Semiconductor device
#77Double-faced cooling-type power module
#78Laminate package of chip on carrier and in cavity
#79Power module and power conversion apparatus having a warpage suppression portion
#80Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereof
#81Thermal stabilization of inertial measurement units
#82Chip protection envelope and method
#83Semiconductor device and alternator using same
#84Semiconductor device
#85Encapsulated microelectromechanical structure
#86Semiconductor device
#87Power conversion apparatus including wedge inserts
#88Semiconductor device
#89Turn-off power semiconductor device with improved centering and fixing of a gate ring, and method for manufacturing the same
#90Disc-shaped thyristor for a plurality of plated-through semiconductor components
#91Semiconductor device with stacked terminals
#92Semiconductor module having an embedded metal heat dissipation plate
#93Semiconductor device
#94Power semiconductor device and method therefor
#95Power semiconductor device
#96Magneto-resistive chip package including shielding structure
#97Semiconductor device, and alternator and power conversion device which use same
#98Gated diode in a press-fit housing and an alternator assembly having a gated diode arranged in a load path
#99Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit
#100Semiconductor device
#101IGBT device and method for packaging whole-wafer IGBT chip
#102Semiconductor device
#103Electronic module and method of manufacturing the same
#104Encapsulated microelectromechanical structure
#105Semiconductor device and method of manufacturing a semiconductor device
#106Semiconductor device and manufacturing method for the semiconductor device
#107Short-circuit switch having semiconductor switch and arrangement for short-circuiting a three-phase alternating voltage
#108Semiconductor device manufacturing method and semiconductor device
#109Semiconductor device
#110Spacer system for a semiconductor switching device
#111Semiconductor device and manufacturing method of semiconductor device
#112Power semiconductor module
#113Semiconductor module
#114Semiconductor module for high pressure applications
#115Method for manufacturing semiconductor device
#116Electronic component and method for dissipating heat from a semiconductor die
#117Semiconductor device
#118Semiconductor assembly comprising chip arrays
#119Semiconductor device and method of manufacturing semiconductor device
#120Power module including first and second sealing resins
#121Semiconductor device with plated lead frame, and method for manufacturing thereof
#122Semiconductor apparatus
#123Semiconductor device and semiconductor device connection structure
#124Sintered backside shim in a press pack cassette
#125Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement
#126Semiconductor module including a terminal embedded in casing wall and bent over thick portion of lid
#127Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement
#128Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement
#129Wafer encapsulated microelectromechanical structure
#130Semiconductor device and manufacturing method thereof
#131Semiconductor device and method for manufacturing semiconductor device
#132Semiconductor device
#133Small footprint semiconductor package
#134Voidlessly encapsulated semiconductor die package
#135Multi-level semiconductor package
#136Stack die package
#137Semiconductor device and method for manufacturing the same
#138Power semiconductor module and power semiconductor module assembly with multiple power semiconductor modules
#139Laser diode package
#140Semiconductor device
#141Axial semiconductor package
#142Electronic semi-conductor device intended for mounting in a pressed stack assembly, and a pressed stack assembly comprising such device
#143Package structure having micro-electro-mechanical system element and method of fabrication the same
#144Cooling apparatus
#145Power semiconductor device and method therefor
#146Power electronic devices
#147Gated diode, battery charging assembly and generator assembly
#148Pressure contact arrangement and method for producing a pressure contact arrangement
#149Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
#150Semiconductor module and semiconductor device
#151Semiconductor device and method of manufacturing the same
#152System in package and method for manufacturing the same
#153Electrical device, system and method for operating with reduced acoustic noise generation
#154Multi-transistor exposed conductive clip for semiconductor packages
#155Device including two power semiconductor chips and manufacturing thereof
#156METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
#157MOTOR DRIVE CIRCUIT MODULE
#158Semiconductor module
#159Power module, method for manufacturing power module, and molding die
#160POWER SEMICONDUCTOR ARRANGEMENT, POWER SEMICONDUCTOR MODULE WITH MULTIPLE POWER SEMICONDUCTOR ARRANGEMENTS, AND MODULE ASSEMBLY COMPRISING MULTIPLE POWER SEMICONDUCTOR MODULES
#161PRESSPIN, POWER SEMICONDUCTER MODULE AND SEMICONDUCTER MODULE ASSEMBLY WITH MULTIPLE POWER SEMICONDUCTER MODULES
#162HIGH VOLTAGE HIGH PACKAGE PRESSURE SEMICONDUCTOR PACKAGE
#163Multi-transistor exposed conductive clip for high power semiconductor packages
#164MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING CURED MULTILAYER RESIN SHEET, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING THE SAME
#165POWER SEMICONDUCTOR DEVICE
#166Semiconductor device
#167SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER
#168Semiconductor device and method for manufacturing the same
#169Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip
#170HEAT SINKS WITH MILLICHANNEL COOLING
#171SEMICONDUCTOR MODULE WITH RESIN-MOLDED PACKAGE OF HEAT SPREADER AND POWER SEMICONDUCTOR CHIP
#172HIGH FREQUENCY FAST RECOVERY DIODE
#173Power semiconductor module
#174High voltage high package pressure semiconductor package
#175Silicon carbide semiconductor
#176ELECTRICAL MODULE
#177Semiconductor element module and method for manufacturing the same
#178Welding Assembled Structure of Diode in Rectifier for Generator
#179Semiconductor switching device with gate connection
#180Method for manufacturing semiconductor apparatus
#181Double side cooled power module with power overlay
#182Electrical device, system and method for operating with reduced acoustic noise generation
#183Flexible diode package and method of manufacturing
#184Rectification chip terminal structure
#185Power semiconductor module with a hermetically tight circuit arrangement and method for producing such a module
#186Semiconductor device
#187Radio frequency power semiconductor device comprising matrix of cavities as dielectric isolation structure
#188Semiconductor device
#189Package for a Die
#190RECTIFYING DIODE PACKAGE STRUCTURE
#191Semiconductor module molded by resin with heat radiation plate opened outside from mold
#192RECTIFICATION CHIP TERMINAL STRUCTURE
#193Semiconductor device comprising a housing containing a triggering unit
#194Semiconductor package and method for manufacturing the same
#195Arrangement including a semiconductor device and a connecting element
#196Semiconductor apparatus having a first and a second projection portion on opposite surfaces of a semiconductor wafer and method for manufacturing the same
#197Semiconductor device used for a rectifier of a vehicle alternator
#198Integrated circuit with flexible planer leads
#199Power semiconductor module
#200POWER SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING IT
#201Semiconductor package structure for vertical mount and method
#202Pressure-contact semiconductor device
#203Semiconductor apparatus having improved thermal fatigue life
#204Semiconductor circuit arrangement
#205Electronic device and method of manufacturing the same
#206Semiconductor device
#207Wafer encapsulated microelectromechanical structure and method of manufacturing same
#208Wafer encapsulated microelectromechanical structure and method of manufacturing same
#209Wafer encapsulated microelectromechanical structure and method of manufacturing same
#210Wafer encapsulated microelectromechanical structure and method of manufacturing same
#211Wafer encapsulated microelectromechanical structure and method of manufacturing same
#212Wafer encapsulated microelectromechanical structure and method of manufacturing same
#213Wafer encapsulated microelectromechanical structure and method of manufacturing same
#214Wafer encapsulated microelectromechanical structure and method of manufacturing same
#215Wafer encapsulated microelectromechanical structure and method of manufacturing same
#216Wafer encapsulated microelectromechanical structure and method of manufacturing same
#217Semiconductor module and power conversion device
#218Pressure-contact type rectifier with contact friction reducer
#219Semiconductor device module structure
#220Semiconductor package structure for vertical mount and method
#221Press-fit power diode
#222Structure of power semiconductor with twin metal and ceramic plates
#223Radio frequency power semiconductor device package comprising dielectric platform and shielding plate
#224Semiconductor device having metallic plate with groove
#225Power semiconductor device and method therefor
#226Thermionic vacuum diode device with adjustable electrodes
#227Resin mold type semiconductor device
#228Thyristor with integrated resistance and method for producing it
#229Power semiconductor device and method therefor
#230Embedded-type power semiconductor package device
#231Semiconductor device
#232Component arrangement for series terminal for high-voltage applications
#233Power semiconductor module with auxiliary connection
#234Diode
#235Semiconductor device and manufacturing method of the same
#236Power semiconductor module
#237Press pack power semiconductor module
#238Method of making a semiconductor package with integrated heat spreader attached to a thermally conductive substrate core
#239Functional coating of the SCFM preform
#240Semiconductor device having aluminum electrode and metallic electrode
#241Semiconductor module
#242Pressure-contact type semiconductor device
#243Semiconductor package
#244Electronic device and method of manufacture the same
#245Thermionic vacuum diode device with adjustable electrodes
#246Semiconductor device having radiation structure
#247Electrode-type heat sink
#248Optical scanning device, image forming apparatus, and optical scanning method
#249Thermionic vacuum diode device with adjustable electrodes
#250Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material
#251Multi-chip press-connected type semiconductor device
#252Rectifier diode device
#253Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces