207586 ⎘
Details of semiconductor or other solid state devices; Fillings or auxiliary members in containers or encapsulations , e.g. centering rings; Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device liquid at the normal operating temperature of the device
FLUID-INFUSED ENCAPSULATION OF WATER-SENSITIVE MATERIALS WITH REPLENISHABLE, MULTISCALE WATER REPELLENCY
#2TECHNOLOGIES FOR LIQUID METAL MIXTURES FOR ELECTRICAL INTERCONNECTS
#3LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS
#4DAM SURROUNDING A DIE ON A SUBSTRATE
#5Semiconductor package device
#6Low force liquid metal interconnect solutions
#7Crack identification in IC chip package using encapsulated liquid penetrant contrast agent
#8Packaging cover plate, organic light-emitting diode display and manufacturing method therefor
#9Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
#10Cooling devices including a variable angle contact surface and methods for cooling heat-generating devices with a cooling device
#11Bonded structures
#12Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
#13Thermal management solutions for embedded integrated circuit devices
#14Power electronics assemblies with CIO bonding layers and double sided cooling, and vehicles incorporating the same
#15Electronic power module comprising a dielectric support
#16Packaged electronic devices with top terminations
#17Printed circuit board and method for manufacturing printed circuit board
#18Power electronics assemblies with cio bonding layers and double sided cooling, and vehicles incorporating the same
#19Power semiconductor device and method of manufacturing the same, and power conversion device
#20Methods of manufacturing packaged electronic devices with top terminations
#21Bonded structures
#22LIQUID UNDERFILL MATERIAL COMPOSITION FOR SEALING SEMICONDUCTOR AND FLIP-CHIP SEMICONDUCTOR DEVICE
#23Packaged electronic devices with top terminations, and methods of manufacture thereof
#24Electric power converter with a spring member
#25Semiconductor module for high pressure applications
#26Self-similar and fractal design for stretchable electronics
#27Stretchable electronic systems with containment chambers
#28ENCAPSULANT COMPOSITION
#29Method of manufacturing semiconductor device
#30Stretchable electronic systems with fluid containment
#31High voltage semiconductor devices including electric arc suppression material and methods of forming the same
#32Semiconductor chip device with liquid thermal interface material
#33Method for manufacturing a stacked device conductive path connectivity
#34SEMICONDUCTOR DEVICE
#35ELECTRONIC PACKAGE DEVICE
#36Stacked device conductive path connectivity
#37Fluid encapsulant for protecting electronics
#38Packaging for high power integrated circuits
#39Semiconductor device having filler with thermal conductive particles
#40Chip on a board
#41Wireless chip and manufacturing method of the same