207588 ⎘
Details of semiconductor or other solid state devices; Fillings or auxiliary members in containers or encapsulations , e.g. centering rings; Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
ELECTRONIC PACKAGE ASSEMBLY WITH A COOLING SYSTEM AND A METHOD FOR FORMING THE SAME
#2OPTICAL DEVICE
#3PARTIALLY SHIELDED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
#4High-Temperature Material Processing In The Absence Of Hydrogen
#5METHODS AND SYSTEMS FOR FABRICATION OF INFRARED TRANSPARENT WINDOW WAFER WITH INTEGRATED ANTI-REFLECTION GRATING STRUCTURES
#6SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
#7SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
#8HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
#9SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
#10METHOD OF MANUFACTURING A SENSOR DEVICE
#11FLUID-INFUSED ENCAPSULATION OF WATER-SENSITIVE MATERIALS WITH REPLENISHABLE, MULTISCALE WATER REPELLENCY
#12ENHANCED AREA GETTER ARCHITECTURE FOR WAFER-LEVEL VACUUM PACKAGED UNCOOLED FOCAL PLANE ARRAY
#13BONDED STRUCTURES
#14SEMICONDUCTOR SENSOR AND METHOD FOR MANUFACTURING SAME
#15BONDED STRUCTURES
#16SEMICONDUCTOR MODULE
#17Semiconductor encapsulant strength enhancer
#18Module with Gas Flow-Inhibiting Sealing at Module Interface to Mounting Base
#19Micro-electromechanical system and method for producing same
#20OMNI DIRECTIONAL INTERCONNECT WITH MAGNETIC FILLERS IN MOLD MATRIX
#21Bonded structures
#22High-capacity dispensable getter
#23Electroluminescent device including color rendering materials
#24Crack identification in IC chip package using encapsulated liquid penetrant contrast agent
#25Semiconductor apparatus and semiconductor apparatus leak inspection method
#26Module with gas flow-inhibiting sealing at module interface to mounting base
#27Packaging cover plate, organic light-emitting diode display and manufacturing method therefor
#28Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers
#29Organic light emitting diode display panel and packaging method thereof
#30Moisture and hydrogen adsorption getter and method of fabricating the same
#31Hermetically sealed optically transparent wafer-level packages and methods for making the same
#32Semiconductor devices comprising getter layers and methods of making and using the same
#33Thin film getter and manufacturing method therefor
#34Display panel, array substrate, display device and method for fabricating array substrate
#35Hermetically sealed electronic packages with electrically powered multi-pin electrical feedthroughs
#36DIE BACKSIDE STRUCTURES FOR ENHANCING LIQUID COOLING OF HIGH POWER MULTI-CHIP PACKAGE (MCP) DICE
#37Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers
#38External gettering method and device
#39LED system
#40Semiconductor package with inner and outer cavities
#41Microsystem device comprising integrated desiccant monitoring
#42Infra-red device
#43Bonded structures
#44Methods and apparatus for gettering impurities in semiconductors
#45Package structure and method of fabricating package structure
#46Moisture and hydrogen-absorbing getter and method for manufacturing same
#47TRANSMISSIVE COMPOSITE FILM FOR APPLICATION TO THE BACKSIDE OF A MICROELECTRONIC DEVICE
#48Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging
#49Display apparatus and multi screen display apparatus comprising the same
#50Composition for heat-dissipating member, heat-dissipating member, electronic instrument, and method for producing heat-dissipating member
#51Device for detecting a leak in a sealed enclosure
#52Sheet for absorbing moisture
#53Gettering layer forming method
#54Semiconductor devices and methods of manufacturing the same
#55Semiconductor device comprising a die seal including long via lines
#56Wafer level package solder barrier used as vacuum getter
#57Array substrate and display device
#58Semiconductor device comprising a die seal including long via lines
#59Method for remapping a packaged extracted die
#603D printed hermetic package assembly and method
#61Remapped packaged extracted die
#62Remapped packaged extracted die with 3D printed bond connections
#63Repackaged integrated circuit assembly method
#64Semiconductor package with barrier for radio frequency absorber
#65GETTER COMPOSITION COMPRISING MAGNESIUM OXIDE PARTICLES DOPED WITH ALKALI METAL (As Amended)
#66Formation of getter layer for memory device
#67Corrosion resistant chip sidewall connection with crackstop and hermetic seal
#68Encapsulation film and organic electronic device comprising the same
#69Semiconductor devices and methods of manufacturing the same
#70Display substrate and display device
#71Semiconductor devices having through electrodes and methods of manufacturing the same
#72Semiconductor devices comprising getter layers and methods of making and using the same
#73Semiconductor device and method of manufacturing thereof
#74Use of an external getter to reduce package pressure
#75External gettering method and device
#76MEMS DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#77Semiconductor chip arrangement and method thereof
#78Wafer level package solder barrier used as vacuum getter
#79Semiconductor devices comprising getter layers and methods of making and using the same
#80SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#81Circuit carrier including a silicone polymer coating
#82Integrated circuit with hydrogen absorption structure
#83Image sensor and method of manufacturing the same
#84Bonded system and a method for adhesively bonding a hygroscopic material
#85Integrated circuit carrier coating
#86Semiconductor device, related manufacturing method, and related electronic device
#87Repackaged integrated circuit and assembly method
#88Trench metal-insulator-metal capacitor with oxygen gettering layer
#89Integrated circuit with printed bond connections
#90Environmental sensor structure
#91Fingerprint sensing device with protective coating
#92Semiconductor chip arrangement
#93Lid body, package, and electronic apparatus
#94Method of improving getter efficiency by increasing superficial area
#95External gettering method and device
#96Module arrangement for power semiconductor devices
#97Semiconductor device, related manufacturing method, and related electronic device
#98Adhesive tape containing getter material
#99Package for housing electronic component and electronic device
#100Wafer level package solder barrier used as vacuum getter
#101SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF MANUFACTURING THE SAME
#102Getter structure and method for forming such structure
#103Device having at least two wafers for detecting electromagnetic radiation and method for producing said device
#104Semiconductor devices comprising getter layers and methods of making and using the same
#105Method to fabricate a substrate including a material disposed on the edge of one or more non through hole formed in the substrate
#106Encapsulation structure comprising trenches partially filled with getter material
#107Devices including, methods using, and compositions of reflowable getters
#108Electronic component having a corrosion-protected bonding connection and method for producing the component
#109Layer arrangement and a wafer level package comprising the layer arrangement
#110Method of improving getter efficiency by increasing superficial area
#111Cup-like getter scheme
#112Wafer level package solder barrier used as vacuum getter
#113Semiconductor device
#114Semiconductor devices comprising getter layers and methods of making and using the same
#115Semiconductor devices comprising getter layers and methods of making and using the same
#116Method and apparatus for printing integrated circuit bond connections
#117SOI wafer, manufacturing method therefor, and MEMS device
#118Electronic device package structure and manufacturing method thereof
#119Method, system, and apparatus for preparing substrates and bonding semiconductor layers to substrates
#120Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device
#121Control device with a getter layer for use in a motor vehicle
#122Encapsulated arrays of electronic switching devices
#123MOLDING MATERIAL, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR DEVICE
#124SOI wafer, manufacturing method therefor, and MEMS device
#125Method for the production of a substrate comprising embedded layers of getter material
#126Dispensable polymeric precursor composition for transparent composite sorber materials
#127Structure for hermetic encapsulation of a device and an electronic component
#128Devices including, methods using, and compositions of reflowable getters
#129Process for encapsulating a micro-device by attaching a cap and depositing getter through the cap
#130Resin film forming sheet for chip, and method for manufacturing semiconductor chip
#131SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND OPTICAL DEVICE
#132Methods and systems of retrieving documents
#133Semiconductor device
#134Barrier structure
#135THIN FILM DESICCANT AND METHOD OF FABRICATION
#136External gettering method and device
#137Method for assembling and hermetically sealing an encapsulating package
#138EMI Shielding in a Package Module
#139Housing having separate getter chamber for device operating under vacuum
#140Flexible electronic devices and related methods
#141Packaging structure of a micro-device including a getter material
#142Heat sink for a pulsed high-power laser diode
#143VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD HAVING VACUUM SEALED PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING VACUUM SEALED PACKAGE
#144Inductive getter activation for high vacuum packaging
#145Package of environmental sensitive element and encapsulation method of the same
#146Method for forming a micro-surface structure and for producing a micro-electromechanical component
#147Devices including, methods using, and compositions of reflowable getters
#148Devices including, methods using, and compositions of reflowable getters
#149LITHIUM OR BARIUM BASED FILM GETTERS
#150Integrated circuits having TSVs including metal gettering dielectric liners
#151ELECTRONIC COMPONENT
#152Methods and materials for the reduction and control of moisture and oxygen in OLED devices
#153Getter having two activation temperatures and structure comprising this getter
#154Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
#155Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the same
#156Semiconductor chip having island dispersion structure and method for manufacturing the same
#157Cavity structure comprising an adhesion interface composed of getter material
#158Treatment method of a getter material and encapsulation method of such getter material
#159Integrated circuits having TSVs including metal gettering dielectric liners
#160Formulations for improved electrodes for electronic devices
#161Encapsulation process and structure for electronic devices
#162Method and device of preventing delamination of semiconductor layers
#163Organic electroluminescence device and manufacturing method thereof
#164Display device with desiccant
#165Structure comprising a getter layer and an adjusting sublayer and fabrication process
#166Structure comprising a getter layer and an adjusting sublayer and fabrication process
#167RADIATION-CURABLE RUBBER ADHESIVE/SEALANT
#168Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control
#169COATED MOLECULAR SIEVE
#170MICROPACKAGING METHOD AND DEVICES
#171Method for the sorption of gaseous contaminants by means of nanostructured sorbers in the form of a fiber
#172Reduced stiction and mechanical memory in MEMS devices
#173Suspended getter material-based structure
#174TRENCH ISOLATION FOR REDUCED CROSS TALK
#175Methods and materials for the reduction and control of moisture and oxygen in OLED devices
#176Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control
#177Getter formed by laser-treatment and methods of making same
#178GASKET SYSTEM FOR LIQUID-METAL THERMAL INTERFACE
#179STORAGE SYSTEM FOR COMPONENTS INCORPORATING A LIQUID-METAL THERMAL INTERFACE
#180Low cost hermetically sealed package
#181AUTOMOTIVE ELECTRIC/ELECTRONIC PACKAGE
#182Semiconductor device, structure of mounting the same, and method of removing foreign matter from the same
#183Indented lid for encapsulated devices and method of manufacture
#184Partitioning of electronic packages
#185Transparent desiccating agent
#186Wafer level packaging integrated hydrogen getter
#187Gettering material for encapsulated microdevices and method of manufacture
#188Wafer level package and wafer level packaging method
#189Methods of conditioning getter materials
#190Capture of residual refractory metal within semiconductor device
#191Hydrogen getter
#192Package-type solid-state imaging apparatus with exhausting means
#193Electroluminescent device with liquid-repellent portion and electronic apparatus
#194Getter systems comprising one or more deposits of getter material and a layer of material for the transport of water
#195Thin film getter protection
#196Airtight package comprising a pressure adjustment unit
#197Curable thick film paste compositions for use in moisture control
#198Gettering/stop layer for prevention of reduction of insulating oxide in metal-insulator-metal device
#199Carbon dioxide gettering for a chip module assembly
#200Wafer-level packaging of micro devices
#201Semiconductor storage device, semiconductor device, and manufacturing method therefor
#202Support device with discrete getter material microelectronic devices
#203Method and apparatus for prevention of solder corrosion
#204Devices including, methods using, and compositions of reflowable getters
#205Carbon dioxide gettering method for a chip module assembly
#206Lewis acid organometallic desiccant
#207Indented structure for encapsulated devices and method of manufacture
#208CHIP STRUCTURE AND FABRICATING PROCESS THEREOF
#209Encapsulation for particle entrapment
#210SEMICONDUCTOR PACKAGE STRUCTURE
#211Getter device
#212Thermal interface apparatus
#213Micromechanical Getter Anchor
#214Semiconductor chip having island dispersion structure and method for manufacturing the same
#215Capture of residual refractory metal within semiconductor device
#216Packaged electronic element and method of producing electronic element package
#217Semiconductor package with getter formed over an irregular structure
#218Electronic device and thermal type flow meter on vehicle
#219Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control
#220Method for encapsulating electronic devices and a sealing assembly for the electronic devices
#221Flat panel display having non-evaporable getter material
#222Low cost hermetically sealed package
#223Getter deposition for vacuum packaging
#224Oxygen-scavenging packaging
#225Placement of absorbing material in a semiconductor device
#226Electronic device sealed under vacuum containing a getter and method of operation
#227Semiconductor storage device, semiconductor device, and manufacturing method therefor
#228Packaging of organic light-emitting diodes using reactive polyurethane
#229Micromechanical getter anchor
#230Package elements and methods for securing a getter
#231Liquid metal thermal interface material system
#232Liquid metal thermal interface material system
#233Chip package mechanism
#234Integrated multi-purpose getter for radio-frequency (RF) circuit modules
#235Getter
#236Curable thick film compositions for use in moisture control
#237Desiccant film in top-emitting OLED
#238Semiconductor package with getter formed over an irregular structure
#239Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
#240Desiccant having a reactive salt
#241Lewis acid organometallic desiccant
#242Getter material
#243Encapsulation for particle entrapment
#244Hygroscopic molding
#245Getter deposition for vacuum packaging
#246Method for adhering getter material to a surface for use in electronic devices
#247Water-absorbing agent for organic EL device and organic EL device
#248Organic electroluminescence device and manufacturing method thereof
#249Semiconductor device of a charge storage type
#250Structure for containing desiccant
#251Device for maintaining an object under vacuum and methods for making same, use in non-cooled infrared sensors
#252Methods and materials for the reduction and control of moisture and oxygen in OLED devices
#253Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices
#254Wafer structure with discrete gettering material
#255MEMS passivation with transition metals
#256Transposed split of ion cut materials
#257REMOTE PLASMA DEPOSITION OF THIN FILMS
#258Method of processing a substrate
#259Method of activating a getter structure
#260Device having a getter structure and a photomask
#261Transport balancing diffusion layer for rate limited scavenging systems
#262Repackaged reconditioned die method and assembly
#263Method of forming a multilayer structure for reducing defects in semiconductor devices and structure
#264Formation of getter layer for memory device
#265Use of an external getter to reduce package pressure
#266Exothermic activation for high vacuum packaging