207592 ⎘
Details of semiconductor or other solid state devices; Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon Organic, e.g. plastic
EMBEDDED PACKAGE WITH DELAMINATION MITIGATION
#302Electronic package including a protection layer
#303UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS
#304PACKAGE SUBSTRATE BASED ON MOLDING PROCESS AND MANUFACTURING METHOD THEREOF
#305Methods of forming semiconductor packages
#306EMBEDDED GLASS CORE PATCH
#307ORGANIC PASSIVATION FOR FINE PITCH ARCHITECTURES
#308ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
#309Chip scale package structure and method of forming the same
#310SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#311METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
#312Semiconductor device, semiconductor device manufacturing method, and power converter
#313Package structure having lid with protrusion and manufacturing method thereof
#314Semiconductor device and method of forming same
#315Chip package structure with multiple gap-filling layers and fabricating method thereof
#316ELECTRONIC COMPONENT WITH MOULDED PACKAGE
#317SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
#318PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND CHIP PACKAGING METHOD
#319SENSOR PACKAGE CAVITIES WITH POLYMER FILMS
#320Semiconductor module and power conversion apparatus
#321Passivation scheme for pad openings and trenches
#322SEMICONDUCTOR PACKAGE
#323SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#324METALLIC SEALANTS IN TRANSISTOR ARRANGEMENTS
#325Chip scale package structure and method of forming the same
#326SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#327BOND FOOT SEALING FOR CHIP FRONTSIDE METALLIZATION
#328PROTECTIVE FILM FORMING AGENT, AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP
#329PROTECTIVE FILM SUBSTANCE FOR LASER PROCESSING AND METHOD OF PROCESSING WORKPIECE
#330FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE
#331RESIN COMPOSITION, RESIN SHEET, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE
#332Metal-bump sidewall protection
#333Edge encapsulation for high voltage devices
#334Semiconductor package and manufacturing method thereof
#335TEMPORARY PASSIVATION LAYER ON A SUBSTRATE
#336RESIN COMPOSITION, ENCAPSULATION STRUCTURE, AND METHOD FOR MANUFACTURING RESIN COMPOSITION
#337Flip chip package unit and associated packaging method
#338FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING A SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE
#339SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING
#340Polyamideimide resin, resin composition, and semiconductor device
#341Semiconductor device
#342Semiconductor device
#3433D Integrated Circuit and Methods of Forming the Same
#344Semiconductor package and manufacturing method thereof
#345Methods of forming integrated circuit packages having adhesion layers over through vias
#346EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#347Semiconductor package
#348Semiconductor Device Comprising a Semiconductor Die and a Carrier both Covered by a Parylene Coating
#349SEMICONDUCTOR PACKAGE
#350Bismaleimide compound, composition containing same, polybenzoxazole, and semiconductor device
#351Integrated circuit medical devices and method
#352Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same, and semiconductor device
#353Negative photosensitive resin composition, production method for polyimide, production method for cured relief pattern, and semiconductor device
#354Display module and system applications
#355Semiconductor device and method for manufacturing semiconductor device
#356DOUBLE-LAYER PACKAGED 3D FAN-OUT PACKAGING STRUCTURE AND METHOD MAKING THE SAME
#357Semiconductor package and method manufacturing the same
#358Methods of fabricating semiconductor package
#359Sensor packages with wavelength-specific light filters
#360TECHNIQUES FOR DIE TILING
#361Package
#362PACKAGE STRUCTURE AND PACKAGE METHOD FOR CAVITY DEVICE GROUP
#363SEMICONDUCTOR MODULE
#364ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
#365Semiconductor device and method of the same
#366Package structure and method for forming same
#3673D Integrated Circuit and Methods of Forming the Same
#368Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
#369Environmentally protected photonic integrated circuit
#370Sensor package cavities with polymer films
#371Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device
#372POLYAMIC ACID COMPOSITION FOR PRODUCING POLYIMIDE RESIN WITH SUPERIOR ADHESION AND POLYIMIDE RESIN PRODUCED THEREFROM
#373Buffer layer(s) on a stacked structure having a via
#374Methods for registration of circuit dies and electrical interconnects
#375Film covers for sensor packages
#376Selective liquiphobic surface modification of substrates
#377BISMALEIMIDE COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION USING SAME, CURED PRODUCT THEREOF, AND SEMICONDUCTOR ELEMENT
#378Wafer system-level three-dimensional fan-out three-dimensional fan-out packaging structure and manufacturing method thereof
#379Semiconductor device and power conversion device
#380Merged power pad for improving integrated circuit power delivery
#381Through wafer trench isolation between transistors in an integrated circuit
#382RESIN SHEET
#383SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC SHIELD
#384SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
#385Electronic device packages with internal moisture barriers
#386CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR A DUAL-SIDED BALL GRID ARRAY PACKAGE
#387Leadframe package with isolation layer
#388CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT-EMBEDDED MODULE
#389TECHNIQUES FOR DIE TILING
#390SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
#391EXTERNAL SECURE AND ENCRYPTED SSD DEVICE AND A SECURE OPERATING SYSTEM ON AN EXTERNAL SSD DEVICE
#392COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE
#393Semiconductor device having through silicon vias and manufacturing method thereof
#394Chip package and method of forming the same
#395Electronic component module
#396Fan-out antenna packaging structure and packaging method
#397Electronic module
#398Semiconductor device and method for forming a semiconductor device
#399Semiconductor package and method of manufacture
#400CHIP PACKAGING APPARATUS AND PREPARATION METHOD THEREOF
#401SEMICONDUCTOR DEVICE
#402Semiconductor device and semiconductor device with cooling member
#403Semiconductor module and manufacturing method of semiconductor module
#404Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure
#405Cross linked surface coating and interfacial layer for a perovskite material photovoltaic device
#406Chip protected against back-face attacks
#407Semiconductor wafer, method for separating the semiconductor wafer, semiconductor chip, and semiconductor package including the semiconductor chip
#408Semiconductor device and manufacturing method thereof
#409SYSTEM-IN-PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
#410CYCLIC PHOSPHAZENE COMPOUND, FLAME RETARDANT FOR RESIN, RESIN COMPOSITION INCLUDING SAME, AND MOLDING OF SAID RESIN COMPOSITION
#411Chip to chip interconnect in encapsulant of molded semiconductor package
#412Method of manufacturing semiconductor device
#413Semiconductor devices with flexible reinforcement structure
#414Liquid cooled module with device heat spreader
#415Semiconductor package and manufacturing method thereof
#416Antenna package for signal transmission
#417COATINGS
#418Display panel with planarization layer and sidewalls
#419Semiconductor packaging structure and method for packaging semiconductor device
#420Underfill flow management in electronic assemblies
#421Semiconductor package and methods of manufacturing a semiconductor package
#422Semiconductor device having via protective layer
#423MOISTUREPROOFING CHIP ON FILM PACKAGE
#424Package structure with warpage-control element
#425Semiconductor package and method
#426Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
#427Semiconductor device and method for manufacturing semiconductor device
#428Semiconductor device
#429Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
#430Apparatuses exhibiting enhanced stress resistance and planarity, and related microelectronic devices and memory devices
#431Semiconductor device package including stress buffering layer
#432Chip heat dissipating structure, chip structure, circuit board and supercomputing device
#433Chip heat dissipation structure, chip structure, circuit board and supercomputing device
#434Protection structures in semiconductor chips and methods for forming the same
#435Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
#436Thermosetting resin compositions, liquid packaging material, film, semiconductor package, interlayer insulating film, and flame-retardant resin composition
#437Display module and system applications
#438Ceramic substrate and electronic component-embedded module
#439Release film and method of manufacturing release film
#440Release film and method of manufacturing release film
#441Sintering method using a sacrificial layer on the backside metallization of a semiconductor die
#442Semiconductor device
#443Processes for adjusting dimensions of dielectric bond line materials and related films, articles and assemblies
#444Conductive traces in semiconductor devices and methods of forming same
#445Dispensable polyimide aerogel prepolymer, method of making the same, method of using the same, and substrate comprising patterned polyimide aerogel
#446Semiconductor device and power converter
#447Semiconductor package having channels formed between through-insulator-vias
#448Cross linked surface coating and interfacial layer for a perovskite material photovoltaic device
#449Semiconductor package and PoP type package
#4503D Integrated Circuit and Methods of Forming the Same
#451Composition for forming coating film and method for manufacturing semiconductor device
#452Control of under-fill using a film during fabrication for a dual-sided ball grid array package
#453ACTIVE ESTER COMPOSITION AND SEMICONDUCTOR SEALING MATERIAL
#454Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
#455Method for Substrate Moisture NCF Voiding Elimination
#456ULTRA-THIN PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT HAVING SENSING FUNCTION AND METHOD FORMING THE SAME
#457Planarizing process and composition
#458Antenna package for signal transmission
#459Display device
#460Encapsulation Method for Flip Chip
#461Chip package, method of forming a chip package and method of forming an electrical contact
#462Selective liquiphobic surface modification of substrates
#463SEMICONDUCTOR PACKAGE
#464Integrated circuit substrate for containing liquid adhesive bleed-out
#465Semiconductor chip stack structure, semiconductor package, and method of manufacturing the same
#466Apparatuses exhibiting enhanced stress resistance and planarity, and related methods
#467Fastening structure and power conversion apparatus using fastening structure
#468Semiconductor device and semiconductor element
#469Methods of fabricating semiconductor package
#470Electronic devices including electrically insulated load electrodes
#471Semiconductor package
#472Step-type stacked chip packaging structure based on resin spacer and preparation process
#473Resin spacer for chip stacking and packaging and preparation method thereof
#474Liquid cooled module with device heat spreader
#4753D Integrated Circuit and Methods of Forming the Same
#476Curable composition and cured product thereof
#477Metal-bump sidewall protection
#478Passivation scheme for pad openings and trenches
#479Semiconductor element, semiconductor device, power conversion device, and method of manufacturing semiconductor element
#480Hybrid integrated circuit package and method
#481Semiconductor device package with stress buffering layer and method for manufacturing the same
#482Packaged semiconductor devices for high voltage with die edge protection
#483Semiconductor device with a dielectric between portions
#484SEMICONDUCTOR APPARATUS WITH HIGH-STABILITY BONDING LAYER AND PRODUCTION METHOD THEREOF
#485Manufacturing method of mounting structure, and sheet therefor
#486Interconnect structures and methods of forming same
#487Substrate treatment method and substrate treatment apparatus
#488Fan-out interconnect structure and method for forming same
#489Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
#490Display panel, display apparatus, method of fabricating display panel, and encapsulating structure
#491Stacked semiconductor die assemblies with die substrate extensions
#492Semiconductor package and method manufacturing the same
#493Semiconductor device and method for manufacturing semiconductor device
#494Chip to chip interconnect in encapsulant of molded semiconductor package
#495CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#496Conductive coating material and production method for shielded package using conductive coating material
#497Module
#498Semiconductor device
#499Fast recovery inverse diode
#500Semiconductor device
#501Epoxy resin composition, process for producing same, and uses of said composition
#502Formation method of package structure with warpage-control element
#503Chip packaging structure
#504Chip package and method of forming the same
#505Semiconductor device having through silicon vias and manufacturing method thereof
#506Semiconductor package and manufacturing method thereof
#507Semiconductor package and manufacturing method thereof
#508Low stress moisture resistant structure of semiconductor device
#509Semiconductor device and method of manufacturing semiconductor device
#510Semiconductor package
#511Methods related to shielded module having compression overmold
#512Device including an α-ray source and an electronic circuit influenced by α-ray
#513Integrated circuit medical devices and method
#514Semiconductor device and method of manufacturing semiconductor device, power conversion device, and moving body
#515Composition for manufacturing passivation layer and passivation layer using the same
#516Semiconductor chip package having optical interface
#517Ink based on fluorinated polymer having improved adhesion
#518Through wafer trench isolation between transistors in an integrated circuit
#519Method for producing semiconductor device
#520Semiconductor package
#521Integrated circuit substrate for containing liquid adhesive bleed-out
#522Semiconductor packages and methods of manufacturing the same
#523Curable resin composition and sealing material using same
#524Method of manufacturing semiconductor device, semiconductor device, and power conversion device
#525Method for producing semiconductor device and intermediate for semiconductor device
#526Display device
#527Display module and system applications
#528Electronic devices comprising butyl rubber
#529Passivation structure and methods of manufacturing a semiconductor device including the same
#530Environmental protection for wafer level and package level applications
#531CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR A DUAL-SIDED BALL GRID ARRAY PACKAGE
#532Anisotropic conductive film
#533Circuit package
#534Method for manufacturing a semiconductor device
#535Epoxy resin composition and electronic component device
#536Limonene-based, non-halogenated flame retardants for polymeric applications
#537Metal-bump sidewall protection
#538Fan-out antenna packaging structure and packaging method
#539Organic light emitting diode display panel comprising multi-layer encapsulation
#540Composition for encapsulating organic electronic element
#541Passivation material for a pillar adjacent a trench
#542Buffer layer(s) on a stacked structure having a via
#543Semiconductor structure and method of forming
#544Underfill material, underfill film, and method for manufacturing semiconductor device using same
#545Method of making cured parts
#546Methods of forming connector pad structures, interconnect structures, and structures thereof
#547Semiconductor structure with polyimide packaging and manufacturing method
#548Wafer level package (WLP) and method for forming the same
#549IR assisted fan-out wafer level packaging using silicon handler
#550SEMICONDUCTOR MODULE, DISPLAY DEVICE, AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
#551SEMICONDUCTOR DEVICE
#552Chip scale package structure and method of forming the same
#553Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device
#554Electronic component module
#555ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
#556Integrated circuit package structure and package method
#557Semiconductor device
#558Packaged semiconductor devices for high voltage with die edge protection
#559Under-fill deflash for a dual-sided ball grid array package
#560Semiconductor device and method for manufacturing semiconductor device
#561Semiconductor device and method of manufacturing the same
#562Protective structure and electronic device with the same
#563Base material, mold package, base material manufacturing method, and mold package manufacturing method
#564Semiconductor device
#565Surface Treatment Compositions and Methods
#566Triazole silane compound, method for synthesizing said compound and use thereof
#567Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same
#568RESIN ENCAPSULATING MOLD AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#569Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer
#570Optical chip ID definition using nanoimprint lithography
#571Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#572Positional relationship among components of semiconductor device
#573Molded Semiconductor Package
#574Semiconductor package and method
#575Package architecture with improved via drill process and method for forming such package
#576POWER DEVICE FOR RECTIFIER
#577Semiconductor device and method for manufacturing semiconductor device
#578Semiconductor device including multiple chips
#579Semiconductor device with island and associated leads
#580Semiconductor device
#581Coatings
#582Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device
#583Fabrication of 3D microelectrodes and use thereof in multi-functional biosystems
#584Epoxy resin composition
#585Solenoid structure with conductive pillar technology
#586Method of manufacturing a semiconductor device
#587Hollow metal pillar packaging scheme
#588TAPERED CORNER PACKAGE FOR EMI SHIELD
#589Manufacturing a package using plateable encapsulant
#590Semiconductor module
#591Curable resin film and first protective film forming sheet
#592System on package architecture including structures on die back side
#593TECHNIQUES FOR DIE TILING
#594Semiconductor device and method for forming a semiconductor device
#595Semiconductor-encapsulating epoxy resin composition and semiconductor device
#596Optical chip ID definition using nanoimprint lithography
#597Method and curable compound for casting electronic components or component groups
#598Nitride-based electronic device and method for manufacturing same
#599Electronic-component-embedded substrate having a wiring line with a roughened surface, electronic component device, and communication module
#600Flat no-lead packages with electroplated edges