207645 ⎘
Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling; Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
Semiconductor Device and Method Forming Same
#2LEAK-PROOF HEAT DISSIPATION STRUCTURE OF HIGH THERMAL CONDUCTIVITY MATERIALS
#3INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPATION MECHANISMS
#4COMPOSITE THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS
#5SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER
#6HEATSINK FOR RING TYPE INTEGRATED CIRCUITS
#7Packaged Device, Packaged Module, and Power Conversion Device
#8Phase change material (PCM)-based conductive thermal actuator switches and associated stacked and arrayed systems
#9Semiconductor Device and Method Forming Same
#10POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE SAME
#11Power overlay module with thermal storage
#12FLUID CONDUIT WITHIN A PACKAGE SUBSTRATE FOR TWO-PHASE IMMERSION COOLING SYSTEMS
#13Electronic device having flexible, heat conductive layer and associated methods
#14Heat dissipation structure assembly
#15Heat sink with protrusions on multiple sides thereof and apparatus using the same
#16Cooling system providing cooling to an infrastructure having a plurality of heat-generating units
#17Semiconductor device
#18SEMICONDUCTOR MODULE
#19Thermal peak suppression device
#20Shape-memory heat absorbers
#21Scalable thermal ride-through for immersion-cooled server systems
#22Circuit board with phase change material
#23Thermal compensation layers with core-shell phase change particles and power electronics assemblies incorporating the same
#24Cooling systems adapted to be thermally connected to heat-generating equipment
#25Phase change heat-storing mechanisms for substrates of electronic assemblies
#26Heat sink with protrusions on multiple sides thereof and apparatus using the same
#27Heat sink with condensing fins and phase change material
#28HEAT SINK INCORPORATING MICROENCAPSULATED PHASE-CHANGE MATERIAL
#29DIC package comprising perforated foil sheet
#30Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
#31Heat-dissipating device with interfacial enhancements
#32Cooling devices including a variable angle contact surface and methods for cooling heat-generating devices with a cooling device
#33Thermal compensation layers with core-shell phase change particles and power electronics assemblies incorporating the same
#34Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
#35Combined Integration Of Phase Change Materials Into Conduction-Convection-Latent Heat Optimized Thermal Management Through Novel Geometries Enabled In Additive Manufactured Heat Sinks
#36Heat sink with protrusions on multiple sides thereof and apparatus using the same
#37Heat sink assemblies for transient cooling
#38Electronic apparatus, method of controlling electronic apparatus, power reception device, electric device, and system
#39Method for making a heat dissipation structure
#40Heat dissipation device and method, and electronic device
#41Electronic power module comprising a dielectric support
#42Method for manufacturing an ultrathin heat dissipation structure
#43Expanding thermal device and system for effecting heat transfer within electronics assemblies
#44Thermal interface materials including polymeric phase-change materials
#45Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
#46Delivery roll and method for manufacturing thereof
#47Self-heating thermal interface material
#48Thermal interface materials including polymeric phase-change materials
#49Electronic apparatus, method of controlling electronic apparatus, power reception device, electric device, and system
#50Methods and systems for high voltage component cooling in electric vehicle for fast charge
#51Thermal cooling system
#52PHASE CHANGE MATERIAL HEAT SINK USING ADDITIVE MANUFACTURING AND METHOD
#53Materials Including Thermally Reversible Gels
#54Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same
#55Enhanced thermal transfer in a semiconductor structure
#56Phase changing on-chip thermal heat sink
#57ADDITIVE MANUFACTURED PASSIVE THERMAL ENCLOSURE
#58Method and system for phase change material component cooling
#59Phase changing on-chip thermal heat sink
#60METHOD AND APPARATUS FOR CONTROLLING HEAT IN POWER CONVERSION SYSTEMS
#61Heat-transferring and electrically connecting device and electronic device
#62Techniques for transferring thermal energy stored in phase change material
#63Protected electronic device
#64SUPPORT FRAME WITH INTEGRATED PHASE CHANGE MATERIAL FOR THERMAL MANAGEMENT
#65Circuit board and method for manufacturing the same
#66Pin fin heat sink with integrated phase change material and method
#67Thermal interfaces for integrated circuit packages
#68Heat dissipation structure, method for making the same, and electronic device having the same
#69Materials including thermally reversible gels
#70Multi-layer heat dissipating device comprising heat storage capabilities, for an electronic device
#71Expanding thermal device and system for effecting heat transfer within electronics assemblies
#72Heat sink assemblies for transient cooling
#73Passive thermal management system with phase change material
#74Thermosyphon cooling apparatus with isolation of cooled components
#753DIC package comprising perforated foil sheet
#76FLEXIBLE METALLIC HEAT CONNECTOR
#77Semiconductor device including a heat sink structure
#78Composite heat absorption device and method for obtaining same
#79Thermal management using phase change material
#80Phase changing on-chip thermal heat sink
#81Thermal interface materials including polymeric phase-change materials
#82Systems and methods for coupling a semiconductor device of an automation device to a heat sink
#83Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
#84Thermal shield can for improved thermal performance of mobile devices
#85Cooler for semiconductor devices
#86Thermal management system
#87Phase changing on-chip thermal heat sink
#88Heat dissipation structure and device
#89Apparatus comprising a functional component likely to be thermally overloaded during the operation thereof and a system for cooling the component
#90Thermal insulation sheet and method for producing same
#91Stacked semiconductor die assemblies with thermal spacers and associated systems and methods
#92Insulating sheet and manufacturing method for same
#93Thermal interface materials including thermally reversible gels
#94Thermal energy storage with a phase-change material in a non-metal container
#95Electronic apparatus, method of controlling electronic apparatus, power reception device, electric device, and system
#96LATENT HEAT STORAGE DEVICES
#97Phase changing on-chip thermal heat sink
#98Heat-storage composition
#99Method of manufacturing printed-circuit board assembly
#100Thermal management in electronic apparatus with phase-change material and silicon heat sink
#101Support frame with integrated phase change material for thermal management
#102Phase changing on-chip thermal heat sink
#103Electrically conductive element, power semiconductor device having an electrically conductive element and method of manufacturing a power semiconductor device
#104Semiconductor device and heat-conductive sheet
#105Semiconductor device including a phase change material
#106Encapsulated phase change material heat sink and method
#107Thermal interface devices
#108Semiconductor device and method of manufacturing the same
#109Circuit board with phase change material
#110Phase changing on-chip thermal heat sink
#111Thermal management in electronic apparatus with phase-change material and silicon heat sink
#112Stacked semiconductor die assemblies with thermal spacers and associated systems and methods
#113Reusable phase-change thermal interface structures
#114Power semiconductor device including a cooling material
#115Three-dimensional silicon structure for integrated circuits and cooling thereof
#1163DIC package comprising perforated foil sheet
#117Thinned integrated circuit device and manufacturing process for the same
#118Phase changing on-chip thermal heat sink
#119Phase changing on-chip thermal heat sink
#120Method for forming a case for an electronic device and manufactured case structure for electronic device
#121Process for producing at least one through-silicon via with improved heat dissipation, and corresponding three-dimensional integrated structure
#122Process for fabricating a three-dimensional integrated structure with improved heat dissipation, and corresponding three-dimensional integrated structure
#123Semiconductor package having a heat slug and a spacer
#124Semiconductor module system, semiconductor module arrangement and method for mounting a semiconductor module on a heat sink
#125Method and apparatus for controlling heat in power conversion systems
#126Thermal interface materials
#127Semiconductor package with thermal dissipating member and method of manufacturing the same
#128Integrated structure with improved heat dissipation
#129Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance
#130Semiconductor device including a phase change material
#131Phase changing on-chip thermal heat sink
#132Polymer matrices for polymer solder hybrid materials
#133Electronic component and fabrication process of this electronic component
#134Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks
#135Electrical component resin, semiconductor device, and substrate
#136Thermal buffering element
#137Electronic device
#138Phase change type heat dissipating device
#139PHASE CHANGE TYPE HEAT DISSIPATING DEVICE
#140Thermal energy storage with a phase-change material in a non-metal container
#141Enhanced package thermal management using external and internal capacitive thermal material
#142SYSTEM INCLUDING THERMAL INTERFACE MATERIAL
#143Flexible metallic heat connector
#144MATRICES FOR RAPID ALIGNMENT OF GRAPHITIC STRUCTURES FOR STACKED CHIP COOLING APPLICATIONS
#145Thermogenerator comprising phase-change materials
#146System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks
#147Method and system for internal layer-layer thermal enhancement
#148Heat storage member and method for manufacturing the same
#149Semiconductor packages
#150Devices including composite thermal capacitors
#151Motherboard
#152Active thermal management device and thermal management method
#153THERMAL SPREADER WITH PHASE CHANGE THERMAL CAPACITOR FOR ELECTRICAL COOLING
#154In-situ foam materials as integrated heat spreader (IHS) sealant
#155PHASE CHANGE ENERGY STORAGE IN CERAMIC NANOTUBE COMPOSITES
#156Heat storage by phase-change material
#157ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESSES AND OXIDATION OF METALS AND ALLOYS
#158Graphite sheet and heat transfer structure using same
#159Thermal interface materials including thermally reversible gels
#160Polymer matrices for polymer solder hybrid materials
#161Optimized lid attach process for thermal management and multi-surface compliant heat removal
#162Device and method for cooling components using magnetizable phase-change material
#163HEAT SINK
#164Phase Change Heat Spreader Bonded to Power Module by Energetic Multilayer Foil
#165THERMAL INTERCONNECT AND INTEGRATED INTERFACE SYSTEMS, METHODS OF PRODUCTION AND USES THEREOF
#166Semiconductor element cooling structure
#167High energy laser thermal management
#168Device and method for mitigating radio frequency interference
#169Thermal interface materials and methods for making thereof
#170THERMAL INTERFACE MATERIAL AND METHOD FOR MANUFACTURING THE SAME
#171ELECTRONIC PACKAGING AND HEAT SINK BONDING ENHANCEMENTS, METHODS OF PRODUCTION AND USES THEREOF
#172Interconnect and method for mounting an electronic device to a substrate
#173LAYERED THERMAL INTERFACE SYSTEMS METHODS OF PRODUCTION AND USES THEREOF
#174POWER MODULE AND INVERTER FOR VEHICLES
#175System for dissipating heat energy
#176Structures & Methods for Combining Carbon Nanotube Array and Organic Materials as a Variable Gap Interposer for Removing Heat from Solid-State Devices
#177Optimized lid attach process for thermal management and multi-surface compliant heat removal
#178Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof
#179Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled
#180Heat sink for semiconductor device and semiconductor module assembly including the heat sink
#181Thermal interface material with thin transfer film or metallization
#182Structure and method to form a heat sink
#183CHIP PACKAGE ASSEMBLY USING CHIP HEAT TO CURE AND VERIFY
#184Electronic assemblies with hot spot cooling and methods relating thereto
#185HEAT-RADIATING DEVICE WITH COMPOSITE RADIATION EFFICIENCY
#186Microelectronic package, method of manufacturing same, and system including same
#187Thermal interface material with hotspot heat remover
#188Electronic assembly with hot spot cooling
#189Melting temperature adjustable metal thermal interface materials and application thereof
#190Apparatus and method for passive phase change thermal management
#191Semiconductor Device and Method for Manufacturing the Same
#192Phase change material containing fusible particles as thermally conductive filler
#193ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESS AND OXIDATION OF METALS AND ALLOYS
#194Thermally Conducting Multi-Layer Film
#195Polymer matrices for polymer solder hybrid materials
#196Thermal interface materials
#197Array of self supporting thermally conductive insulator parts having a perforated outline surrounding each part to facilitate separation and a method of packaging
#198HEAT DISSIPATION DEVICE
#199Thermal interconnect and interface systems, methods of production and uses thereof
#200Low temperature phase change thermal interface material dam
#201Thermal management system for high energy laser
#202Dendritic fiber material
#203Thermal interface materials, methods of preparation thereof and their applications
#204Heat dissipating member
#205Method and apparatus for cooling with a phase change material and heat pipes
#206Fiber adhesive material
#207Electronic assembly with integral thermal transient suppression
#208Thermal interface structure and process for making the same
#209Thermal interface materials
#210Thermal managed interconnect system for a circuit board
#211Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack
#212Thermal interconnect and interface systems, methods of production and uses thereof
#213Method and apparatus for heat dissipation
#214Thermal transient suppression material and method of production
#215Heat pipe having a wick structure containing phase change materials
#216Phase change material containing fusible particles as thermally conductive filler
#217METHOD AND STRUCTURE FOR HEAT SINK ATTACHMENT IN SEMICONDUCTOR DEVICE PACKAGING
#218Phase change thermal interface composition having induced bonding property
#219Acoustic and thermal energy management system
#220Mechanism for maintaining consistent thermal interface layer in an integrated circuit assembly
#221Use of paraffin-containing powders as phase-change materials (pcm) in polymer composites in cooling devices
#222Power electronic system with passive cooling
#223Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink
#224Thermal interface material
#225Heat sink mounting and interface mechanism and method of assembling same
#226Method for passive phase change thermal management
#227Heat spreading thermal interface structure
#228Phase change thermal interface materials including polyester resin
#229Method of manufacturing a thermal dissipation assembly
#230Optimised application of pcms in chillers
#231Composite thermal interface materials and associated devices, systems, and methods
#232Heat pipe tapered down in fin stack region and oppositely tapered fin stack
#233Heat sink with condensing fins and phase change material
#234Heat sink
#235Stacked silicon package having a thermal capacitance element