207647 ⎘
Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling; Auxiliary members in containers characterised by their shape, e.g. pistons Bellows
PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION COOLING SYSTEMS AND METHODS FOR USING SAME
#2BELLOWS FOR IMMERSION COOLING
#3Bellows for immersion cooling
#4Heterogeneous integrated multi-chip cooler module
#5Evaporator stacks and electronic assemblies
#6Pressure controllable encapsulated liquid thermal interface
#7Waterproof casing with a sealing grommet in a casting hole
#8Heat transfer devices and methods of transfering heat
#9Water cooling module
#10Water cooling module
#11Vehicle thermal management system
#12Power converter
#13Semiconductor module and electronic device
#14Flexible electronic package integrated heat exchanger with cold plate and risers
#15Semiconductor cooling apparatus
#16COMPLIANT VAPOR CHAMBER CHIP PACKAGING
#17Assembly to provide thermal cooling
#18Flexible Heat Exchanger
#19Compliant vapor chamber chip packaging
#20Apparatus and system for cooling heat producing components
#21Liquid cooling device
#22Electronic apparatus and television receiver
#23Electronic apparatus having liquid cooling system therein
#24Conformal heat sink
#25Pressure relief valve and adsorbent chamber for two-phase immersion cooling systems and methods for using same
#26Bellows for immersion cooling