207649 ⎘
Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling; Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
Liquid Jet Impingement Cooler
#2INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME
#3METHODS AND APPARATUS FOR MULTI-ZONE TEMPERATURE CONTROL OF JET IMPINGEMENT COOLING OF INTEGRATED CIRCUIT PACKAGES
#4PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES
#5PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES
#6COOLING APPARATUS
#7Semiconductor Package with Liquid Flow-Over Segmented Inset Lid
#8High Efficiency Thermal Management Devices For Use With Electronic Components Having High Heat Flux Values
#9MEMS-based active cooling systems
#10Mobile phone and other compute device cooling architecture
#11Cooling apparatus with expanding fluid jets
#12Technologies for liquid cooling systems
#13Two-dimensional addessable array of piezoelectric MEMS-based active cooling devices
#14Piezoelectric MEMS-based active cooling for heat dissipation in compute devices
#15Mobile phone and other compute device cooling architecture
#16Thermal management of electronics using co-located microjet nozzles and electronic elements
#17Cooling solution including microchannel arrays and methods of forming the same
#18Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions
#19Method and system for driving piezoelectric MEMS-based active cooling devices
#20Combined architecture for cooling devices
#21Two-dimensional addessable array of piezoelectric MEMS-based active cooling devices
#22Chamber architecture for cooling devices
#23Three-dimensional integrated circuit cooling system
#24Air-cooling heat dissipation device
#25Heat sink cooling with preferred synthetic jet cooling devices
#26Cooler
#27System and method for enhanced convection cooling of temperature-dependent power producing and power consuming electrical devices
#28Cooling assemblies and power electronics modules having multiple-porosity structures
#29Low resonance acoustic synthetic jet structure
#30Thermal management solution for circuit products
#31Heat dissipation system with a spray cooling device
#32COOLING ARRANGEMENT
#33Architecture for gas cooled parallel microchannel array cooler
#34Power Semiconductor Module
#35Cooling facility for cooling a component
#36Moldable housing design for synthetic jet ejector
#37Impingement cooled heat sink with low pressure drop
#38Impingement cooled heat sink with uniformly spaced curved channels
#39Active cooling device
#40Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins
#41Cold plate
#42Chip-scale cooling device having through-silicon vias and flow directing features