207652 ⎘
Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
IC PACKAGE WITH VERY THIN VAPOR CHAMBER FOR HEAT DISSIPATION
#2ELECTRONIC COMPONENTS EMPLOYING FIELD IONIZATION
#3Immersion cooling electronic devices
#4SEMICONDUCTOR DEVICE WITH HIGH-ELECTRON MOBILITY TRANSISTOR
#5DOMINO LOGIC CIRCUITRY WITH KEEPER TRANSISTORS ON BACKSIDE OF INTEGRATED CIRCUIT DIE
#6IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
#7Separating temperature domains in cooled systems
#8Cryogenic integrated circuits
#9Superconducting computing system in a liquid hydrogen environment
#10Physical properties measurement system
#11Memory system with minimized heat generation which includes memory that operates at cryogenic temperature
#12Thermal management and power system for computing infrastructure
#13Systems and methods for storing and distributing gases
#14Superconducting magnet operating in occasional idling mode
#15Heat Transfer For Superconducting Integrated Circuits At Millikelvin Temperatures
#16Integrated electronics cooling device
#17Stacked-plate gas-expansion cooler assembly, fabrication method, and use
#18Solder reflux method for holding cryogenically aligned parts
#19Cooled photodetector
#20Superconducting computing system in a liquid hydrogen environment