207656 ⎘
Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids Jet impingement
MULTI-JET LIQUID IMPINGEMENT MANIFOLD SYSTEM FOR ON-CHIP COOLING
#2CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE
#3JET IMPINGEMENT HEATSINK FOR HIGH POWER SEMICONDUCTOR DEVICES
#4FLUID DISTRIBUTION UNIT FOR TWO-PHASE COOLING SYSTEM
#5Internal Recirculation Cooling Module
#6SEMICONDUCTOR DEVICE HAVING LIQUID COOLING STRUCTURE
#7JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES
#8EMBEDDED JET COOLING FOR SEMICONDUCTOR PRODUCTS
#9ELECTRONIC DEVICE COOLING STRUCTURES BONDED TO SEMICONDUCTOR ELEMENTS
#10Packaged Cold Plate Lids For Optimized Cooling Of High Power Chip Packages And Systems And Methods Incorporating Same
#11JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES USING MONOLITHIC MICROSTRUCTURES
#12Server System Liquid Cooling System
#13JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES
#14JET IMPINGEMENT COOLING WITH BYPASS FLUID PORTION FOR HIGH POWER SEMICONDUCTOR DEVICES
#15DESIGN AND PACKAGING OF WIDE BANDGAP POWER ELECTRONIC POWER STAGES
#16DIRECT POWER MODULE COOLING
#17Internal Recirculation Cooling Module
#18METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL LOADING OF INTEGRATED CIRCUIT PACKAGES
#19FLUID-COOLED POWER MODULE
#20HOOD FOR MEMS-BASED COOLING SYSTEMS
#21Sealed Rack Server Unit
#22JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES
#23COOLING COMPONENT
#24JET IMPINGEMENT HEATSINK FOR HIGH POWER SEMICONDUCTOR DEVICES
#25ELECTRONIC DEVICE COOLING STRUCTURES
#26Anchor and cavity configuration for MEMS-based cooling systems
#27PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES
#28Actively cooled heat-dissipation lids for computer processors and processor assemblies
#29Heat sink
#30THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SUBSTRATE
#31HEAT SINK FOR LIQUID COOLING
#32REDUNDANT HEAT SINK MODULE
#33PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES
#34POWER MODULE THERMAL MANAGEMENT SYSTEM
#35SEMICONDUCTOR COOLING ARRANGEMENT WITH IMPROVED HEATSINK
#36Jet impingement cooling with bypass fluid portion for high power semiconductor devices
#37Diamond Wafer Based Electronic Vehicle Power Electronics
#38Systems for a heat exchanger
#39HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION COOLING
#40Heat sink, heat sink arrangement and module for liquid immersion cooling
#41SYSTEMS AND METHODS OF NANO-PARTICLE BONDING FOR ELECTRONICS COOLING
#42Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems
#43DOUBLE-SIDED COOLING APPARATUS FOR POWER MODULE
#44Jet impingement cooling for high power semiconductor devices
#45COOLING APPARATUS
#46Liquid-cooled assembly and method
#47Power Semiconductor Module with Accessible Metal Clips
#48Flow-through, hot-spot-targeting immersion cooling assembly
#49Anchor and cavity configuration for MEMS-based cooling systems
#50IMPINGEMENT COOLING IN HIGH POWER PACKAGE
#51Packaging of wide bandgap power electronic power stages
#52Heat sink, heat sink arrangement and module for liquid immersion cooling
#53Heat sink for liquid cooling
#54Cooling electronic devices in a data center
#55Hybrid microjet liquid-cooled heat spreader
#56High Efficiency Thermal Management Devices For Use With Electronic Components Having High Heat Flux Values
#57POWER MODULE WITH VASCULAR JET IMPINGEMENT COOLING SYSTEM
#58Fluid cooling system
#59MEMS-based active cooling systems
#60Mobile phone and other compute device cooling architecture
#61Power device embedded driver board assemblies with cooling structures and methods thereof
#62Cooling apparatus with expanding fluid jets
#63Hood for MEMS-based cooling systems
#64Liquid cooling module and method of forming the same
#65Power device embedded driver board assemblies with cooling structures and methods thereof
#66Thermal management of GPU-HBM package by microchannel integrated substrate
#67Vacuum modulated two phase cooling loop efficiency and parallelism enhancement
#68Packaging of wide bandgap power electronic power stages
#69Compact thermal control plate
#70Fluid cooling system
#71Liquid-based heat exchanger
#72Modular microjet cooling of packaged electronic components
#73Microchannel heat exchanger structure with nozzle and working method thereof
#74Jet impingement cooling apparatus and method
#75SYSTEM AND METHOD FOR SAFE MULTILEVEL CHIPS
#76Two-dimensional addessable array of piezoelectric MEMS-based active cooling devices
#77Power electronics unit
#78Piezoelectric MEMS-based active cooling for heat dissipation in compute devices
#79Thermal management of RF devices using embedded microjet arrays
#80Jet impingement cooling for high power semiconductor devices
#81Fluid cooling system
#82Mobile phone and other compute device cooling architecture
#83Impingement cooling device for a laser disk and associated laser disk module
#84Microjet-Cooled Flanges for Electronic Devices
#85Thermal management of electronics using co-located microjet nozzles and electronic elements
#86Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
#87Modular microjet cooling of packaged electronic components
#88Cooling plate, cooling device, and electronic apparatus
#89Electrical connector heat sink with protective ramp
#90Multi-layer cooling structure including through-silicon vias through a plurality of directly-bonded substrates and methods of making the same
#91Heat sink
#92Devices, systems, and methods for the rapid transient cooling of pulsed heat sources
#93Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions
#94Methods of forming power electronic assemblies using metal inverse opals and cap structures
#95Cooling devices including jet cooling with an intermediate mesh and methods for using the same
#96Thermal management of RF devices using embedded microjet arrays
#97Cooling chip structures having a jet impingement system and assembly having the same
#98Power electronics modules including integrated jet cooling
#99High Efficiency Thermal Management Device for Use With Components Having High Heat Flux Values
#100CPU cooling system with direct spray cooling
#101Method and system for driving piezoelectric MEMS-based active cooling devices
#102Combined architecture for cooling devices
#103Two-dimensional addessable array of piezoelectric MEMS-based active cooling devices
#104Chamber architecture for cooling devices
#105Heat sinks and methods for fabricating a heat sink
#106Modular microjet cooling of packaged electronic components
#107Cooling electronic devices in a data center
#108Variable area microjets to cool digital micromirror devices
#109Cooling bond layer and power electronics assemblies incorporating the same
#110Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
#111Multi-layer cooling structure including through-silicon vias through a plurality of directly-bonded substrates and methods of making the same
#112Systems and methods for heat exchanger tubes having internal flow features
#113Redundant heat sink module
#114Coolant contact type cooling system for high-power device and operation method thereof
#115Impingement cooling device for a laser disk and associated laser disk module
#116Thermal management of RF devices using embedded microjet arrays
#117Data centre cabinet and pressure spray system thereof
#118Data centre cabinet and gravity spray system thereof
#119Thermal management devices and systems without a separate wicking structure and methods of manufacture and use
#120Micro Heat Transfer Arrays, Micro Cold Plates, and Thermal Management Systems for Cooling Semiconductor Devices, and Methods for Using and Making Such Arrays, Plates, and Systems
#121Cold plate with combined inclined impingement and ribbed channels
#122Air-cooling heat dissipation device
#123Electronic assemblies having a cooling chip layer with impingement channels and through substrate vias
#124Electronic assemblies having a cooling chip layer with fluid channels and through substrate vias
#125Double-sided cooler
#126Heat sink cooling with preferred synthetic jet cooling devices
#127Cold plate heat exchanger
#128Liquid cooling radiation system and liquid radiator thereof
#129Semiconductor module including a case and base board
#130Method and Apparatus for Cooling Integrated Circuits
#131Power conversion device
#132COOLING DEVICE AND COOLING DEVICE MANUFACTURING METHOD
#133Liquid cooling of electronic devices
#134Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
#135Substrate sprayer
#136Devices, systems, and methods for the rapid transient cooling of pulsed heat sources
#137Liquid cooling block with shunt design and heat dissipating structure thereof
#138Liquid-cooled, composite heat sink assemblies
#139Cooling electronic devices in a data center
#140Cooler
#141Liquid cooled compliant heat sink and related method
#142MICROFLUIDIC CHANNELS FOR THERMAL MANAGEMENT OF MICROELECTRONICS
#143Synthetic jet delivering controlled flow to sensor system
#144Bond head cooling apparatus
#145Liquid cooled compliant heat sink and related method
#146Heat dissipation solution for advanced chip packages
#147High efficiency thermal management system
#148Cold plate with combined inclined impingement and ribbed channels
#149Two-sided jet impingement assemblies and power electronics modules comprising the same
#150Cold plate with combined inclined impingement and ribbed channels
#151Semiconductor cooling device
#152Method and apparatus for chip cooling
#153Jet impingement cooling apparatuses having non-uniform jet orifice sizes
#154Heat exchanging apparatus and method for transferring heat
#155Jet impingement cooling apparatuses having enhanced heat transfer assemblies
#156Cooling fluid flow passage matrix for electronics cooling
#157Cooling assemblies and power electronics modules having multiple-porosity structures
#158Cooling assemblies having porous three dimensional surfaces
#159Jet impingement coolers and power electronics modules comprising the same
#160Semiconductor cooling device
#161Jet impingement cooling apparatuses having non-uniform jet orifice sizes
#162Low resonance acoustic synthetic jet structure
#163Adaptive thermal control
#164Thermal management solution for circuit products
#165Passively controlled smart microjet cooling array
#166Cooling apparatuses having a jet orifice surface with alternating vapor guide channels
#167Modular jet impingement cooling apparatuses with exchangeable jet plates
#168Electronic device cooling with microjet impingement and method of assembly
#169Evaporation-assisted heat dissipation apparatus
#170Two-phase heat transfer assemblies and power electronics incorporating the same
#171Cooling system for electronic components and led lamp having the same
#172Direct air impingement cooling of package structures
#173Cold plate with combined inclined impingement and ribbed channels
#174System for using active and passive cooling for high power thermal management
#175HIGH EFFICIENCY THERMAL MANAGEMENT SYSTEM
#176DUAL-LOOP COOLING SYSTEM
#177COOLING APPARATUSES AND POWER ELECTRONICS MODULES COMPRISING THE SAME
#178Power electronics card assemblies, power electronics modules, and power electronics devices
#179Power electronics modules and power electronics module assemblies
#180Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment
#181Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment
#182SYNTHETIC JET PACKAGING
#183METHOD AND APPARATUS FOR CHIP COOLING
#184Thermal management system and method
#185Cooling apparatuses and power electronics modules
#186Jet impingement heat exchanger apparatuses and power electronics modules
#187High power module cooling system
#188Cooling module and system for lamp device
#189System for cooling a heat-generating device
#190Device for cooling integrated circuits
#191Power electronics substrate for direct substrate cooling
#192Interlocked jets cooling method and apparatus
#193Cooling Device and Method
#194Cooling apparatus with thermally conductive porous material and jet impingement nozzle(s) extending therein
#195Direct jet impingement-assisted thermosyphon cooling apparatus and method
#196Multi-fluid cooling of an electronic device
#197Systems and methods for synthetic jet enhanced natural cooling
#198Thermal controller for electronic devices
#199LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD
#200Metal clad fiber optics for enhanced heat dissipation
#201IGBT cooling method
#202Cooling apparatus with cold plate formed in situ on a surface to be cooled
#203Impingement Cooling
#204Cooling system for electronic structural units
#205System and method for cooling using impinging jet control
#206Inverter power module with distributed support for direct substrate cooling
#207Narrow gap spray cooling in a globally cooled enclosure
#208Electronic board and cold plate for said board
#209PULSATING COOLING SYSTEM
#210Power Semiconductor Module
#211Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled
#212Cooling apparatus and method of fabrication thereof with jet impingement structure integrally formed on thermally conductive pin fins
#213Method and apparatus for chip cooling
#214Temperature Managing For Electronic Components
#215Electrospray Evaporative Cooling (ESC)
#216COOLING DEVICE, HEAT SINK, AND ELECTRONIC APPARATUS
#217Cooling facility for cooling a component
#218Injection cooling heat exchanger for vehicle electrical components
#219COOLING DEVICE AND ELECTRONIC DEVICE COMPRISING SUCH A COOLING DEVICE
#220Method and apparatus for cooling electronic or other devices
#221Microjet module assembly
#222COOLER
#223Evaporation-enhanced thermal management devices, systems, and methods of heat management
#224Fluid-to-fluid spot-to-spreader heat management devices and systems and methods of managing heat
#225Cooling systems for power semiconductor devices
#226System and method for cooling a heat-generating device
#227System and method of boiling heat transfer using self-induced coolant transport and impingements
#228Spray nozzle apparatus and method of use
#229Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices
#230High power microjet cooler
#231COOLING APPARATUS AND COOLED ELECTRONIC MODULE WITH A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED
#232Semiconductor cooling system for use in electric or hybrid vehicle
#233Method and apparatus for high heat flux heat transfer
#234Carbon-based apparatus for cooling of electronic devices
#235Power module having self-contained cooling system
#236Laser device
#237Coupling metal clad fiber optics for enhanced heat dissipation
#238Passive fluid recovery system
#239Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus
#240HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING
#241Spray nozzle apparatus and method of use
#242Cooling systems employing fluidic jets, methods for their use and methods for cooling
#243Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus
#244Moldable housing design for synthetic jet ejector
#245Vibration isolation system for synthetic jet devices
#246DIRECT LIQUID JET IMPINGEMENT MODULE FOR HIGH HEAT FLUX ELECTRONICS PACKAGES
#247Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof
#248Loop type heat dissipating apparatus with sprayer
#249Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled
#250Multi-mode fluid cooling system and method
#251High power microjet cooler
#252Liquid-cooling heat sink
#253Narrow gap spray cooling in a globally cooled enclosure
#254Narrow gap spray cooling in a globally cooled enclosure
#255Passive fluid recovery system
#256Compact spray cooling module
#257Heat transfer apparatus, cooled electronic module and methods of fabrication thereof employing thermally conductive composite fins
#258System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
#259Cooling device
#260Electronic device cooling device and electronic device cooling method
#261Apparatus and method to efficiently cool a computing device
#262Cooling systems incorporating heat exchangers and thermoelectric layers
#263Cooling device for heat-generating elements
#264High performance integrated MLC cooling device for high power density ICS and method for manufacturing
#265Cooling system for a substrate
#266Microjet module assembly
#267Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold
#268Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
#269Cooling assembly with impingement cooled heat sink
#270Full coverage spray and drainage system and method for orientation-independent removal of high heat flux
#271Foil slot impingement cooler with effective light-trap cavities
#272Cooling assembly comprising micro-jets
#273Cooling electronics via two-phase tangential jet impingement in a semi-toroidal channel
#274Two-fluid spray cooling system
#275Ultrasonic atomizing cooling apparatus
#276Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
#277Method and apparatus for high heat flux heat transfer
#278Spray cooling with spray deflection
#279Multi-state spray cooling system
#280Fluidic cooling systems and methods for electronic components
#281Spray cooling system for narrow gap transverse evaporative spray cooling
#282Cooling device for heat source
#283Spray cooling system for transverse thin-film evaporative spray cooling
#284Spray cooling system for transverse thin-film evaporative spray cooling
#285Apparatus, method, and control program for cooling electronic devices
#286Electronic device cooling apparatus and method for cooling electronic device with temperature prediction
#287Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
#288Heat sink
#289Hotspot spray cooling
#290Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
#291Heat dissipating circulatory system with sputtering assembly
#292Dynamic fluid sprayjet delivery system
#293High flux heat removal system using liquid ice
#294Liquid cooling of high current devices in power flow control systems
#295Liquid cooling of high current devices in power flow control systems
#296Systems and methods for implementing intelligent cooling interface archiectures for cooling systems
#297Cooling devices including jet cooling with an intermediate mesh and methods for using the same
#298Microfluidic impingement jet cooled embedded diamond GaN HEMT