207660 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body Bridge structure with air gap
SEMICONDUCTOR DEVICE
#2PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME
#3SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE STRUCTURE
#4MULTI-DIE ASSEMBLIES WITH GLASS SUPPORT STRUCTURES
#5INTEGRATED CIRCUIT DIE STACK WITH A DUAL-SIDED BRIDGE DIE
#6RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
#7COMPONENT COUPLED WITH CONDUCTIVE VIAS ENCAPSULATED IN AN ELECTRONIC SUBSTRATE
#8TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRATE CORE
#9MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES
#10BRIDGES OVER METAL VOIDS IN INTEGRATED CIRCUIT PACKAGES
#11DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
#12PACKAGE ARCHITECTURE WITH PACKAGE SUBSTRATE HAVING BLIND CAVITY WITH ROUTING ON SIDEWALLS
#13PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME
#14AIR BRIDGE PREPARATION METHOD, QUANTUM CHIP, AND QUANTUM COMPUTER
#15SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#16Conductive Features with Air Spacer and Method of Forming Same
#17REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
#18SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
#19AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER
#20Air Gap Seal for Interconnect Air Gap and Method of Fabricating Thereof
#21CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MANUFACTURING THE SAME
#22CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MANUFACTURING THE SAME
#23Micro assembled LED displays and lighting elements
#24Reducing RC delay in semiconductor devices
#25SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#26LIGHT DETECTION MODULE AND BEAT SPECTROMETER
#27PHOTODETECTOR AND BEATING SPECTROSCOPY DEVICE
#28Conductive features with air spacer and method of forming same
#29Semiconductor device and manufacturing method thereof
#30Reducing RC delay in semiconductor devices
#31Air gap seal for interconnect air gap and method of fabricating thereof
#32AIR BRIDGE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SUPERCONDUCTING QUANTUM CHIP AND MANUFACTURING METHOD THEREOF
#33Semiconductor structure with an air gap
#34SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#35Reducing RC delay in semiconductor devices
#36Distributed inductance integrated field effect transistor structure
#37Open cavity bridge power delivery architectures and processes
#38Open cavity bridge co-planar placement architectures and processes
#39Semiconductor memory device having spacer capping pattern disposed between burried dielectic pattern and an air gap and method of fabricating same
#40On-chip decoupling capacitor
#41Semiconductor device
#42Semiconductor structure and method for forming the same
#43Photonic wafer communication systems and related packages
#44Semiconductor structure with an air gap
#45Micro assembled LED displays and lighting elements
#46Semiconductor device and manufacturing method thereof
#47Semiconductor device
#48Air gap seal for interconnect air gap and method of fabricating thereof
#49Semiconductor device
#50Semiconductor device
#51Bridge interconnection with layered interconnect structures
#52Semiconductor device and method for manufacturing same
#53Integrated circuit with airgaps to control capacitance
#54Microfabricated air bridges for planar microwave resonator circuits
#55Semiconductor device
#56Micro assembled LED displays and lighting elements
#57Microfabricated air bridges for planar microwave resonator circuits
#58Semiconductor device
#59Bridge interconnection with layered interconnect structures
#60Semiconductor module
#61Semiconductor device, method for manufacturing semiconductor device, and electronic device
#62Semiconductor array and production method for micro device
#63Air gap and air spacer pinch off
#64Transistor with an airgap for reduced base-emitter capacitance and method of forming the transistor
#65Air gap and air spacer pinch off
#66Air gap and air spacer pinch off
#67Air gap and air spacer pinch off
#68Air gap over transistor gate and related method
#69Bridge leg circuit assembly and full-bridge circuit assembly
#70Multi-finger transistor and semiconductor device
#71Sensor
#72Method for forming semiconductor structure
#73Semiconductor constructions
#74SEMICONDUCTOR DEVICE AND TRANSMITTER
#75IC die, ultrasound probe, ultrasonic diagnostic system and method
#76Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
#77Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
#78Display with color conversion
#79Semiconductor devices having air spacers and methods of manufacturing the same
#80Semiconductor devices
#81Semiconductor structure having thermal backside core
#82Stacked interconnect structure and method of making the same
#83Bridge interconnect with air gap in package assembly
#84Method of operating an integrated switchable capacitive device
#85Multilevel mask circuit fabrication and multilayer circuit
#86Method of making an integrated switchable capacitive device
#87Air bridge structure having dielectric coating
#88Micro assembled LED displays and lighting elements
#89Micro assembled LED displays and lighting elements
#90Micro assembled LED displays and lighting elements
#91Bridge interconnection with layered interconnect structures
#92Compound semiconductor device and method of manufacturing the same
#93Stacked interconnect structure and method of making the same
#94Air bridge structure having dielectric coating
#95Semiconductor device having an airbridge and method of fabricating the same
#96Conductive line structures and methods of forming the same
#97Semiconductor device
#98Self-aligned airgap interconnect structures
#99Bridge interconnection with layered interconnect structures
#100Copper interconnect structures and methods of making same
#101Semiconductor devices and methods of fabricating the same
#102Methods for fabrication of an air gap-containing interconnect structure
#103Copper interconnect structures and methods of making same
#104Bridge interconnect with air gap in package assembly
#105Semiconductor device with air gap and method for fabricating the same
#106Wafer with spacer including horizontal member
#107Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
#108Semiconductor device having improved RF characteristics and moisture resistance and method for manufacturing the same
#109Monolithic microwave integrated circuit (MMIC) including air bridge coupler
#110Semiconductor apparatus and manufacturing method thereof
#111Semiconductor device and method of producing the same
#112Scalable construction for lateral semiconductor components having high current-carrying capacity
#113Semiconductor device
#114Wafer with spacer including horizontal member
#115Method for forming self-aligned airgap interconnect structures
#116Device with gaps for capacitance reduction
#117Semiconductor device having an airbridge and method of fabricating the same
#118Power amplifying device and coupled power amplifying device
#119Method of manufacturing airbridge
#120Semiconductor structure having a contact-level air gap within the interlayer dielectrics above a semiconductor device and a method of forming the semiconductor structure using a self-assembly approach
#121SEMICONDUCTOR DEVICE
#122Methods for fabrication of an air gap-containing interconnect structure
#123Semiconductor device
#124Semiconductor device and manufacturing method of the same
#125Semiconductor device having finger electrodes
#126Semiconductor device and fabrication method for the semiconductor device
#127Passivation layer for a circuit device and method of manufacture
#128Semiconductor device and manufacturing method thereof
#129Methods of making an environment protection coating system
#130Environmental protection coating system and method
#131Environmental protection coating system and method
#132Semiconductor device and fabrication method for the semiconductor device
#133Apparatus for providing device with gaps for capacitance reduction
#134Power semiconductor packaging method and structure
#135Field effect transistor with air bridge
#136Semiconductor device for high frequency
#137Passivation layer for a circuit device and method of manufacture
#138Environmental protection coating system and method
#139Selective electroless-plated copper metallization
#140Device with gaps for capacitance reduction
#141Field-effect transistor
#142Selective electroless-plated copper metallization
#143Packaging of electronic chips with air-bridge structures
#144Power semiconductor packaging method and structure
#145PACKAGING OF ELECTRONIC CHIPS WITH AIR-BRIDGE STRUCTURES
#146PACKAGING OF ELECTRONIC CHIPS WITH AIR-BRIDGE STRUCTURES
#147Semiconductor device and method of manufacturing the same
#148Packaging of electronic chips with air-bridge structures
#149High-frequency semiconductor device
#150Packaging of electronic chips with air-bridge structures
#151Selective electroless-plated copper metallization
#152Mechanically-stable BJT with reduced base-collector capacitance
#153Semiconductor device having a flip-chip construction
#154Method of making wide tuning range and super low capacitance varactor diodes
#155Method for forming semiconductor device and semiconductor device fabricated by the same
#156Metal-semiconductor heterodimension field effect transistors (MESHFET) and high electron mobility transistor (HEMT) based device and method of making the same
#157Fine-scale interconnect with micro-air bridge
#158Air gap and air spacer pinch off
#159Field effect transistor devices having interconnect structures and manufacturing method thereof