207667 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts Overhang structure
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#2Semiconductor package and method of manufacturing the same
#3Dense Redistribution Layers in Semiconductor Packages and Methods of Forming the Same
#4Method for manufacturing a semiconductor package having a conductive pad with an anchor flange
#5Power electronic switching device with a three-dimensionally preformed insulation molding and a method for its manufacture
#6Semiconductor package having a conductive pad with an anchor flange
#7Semiconductor package and method of manufacturing the same
#8Dense redistribution layers in semiconductor packages and methods of forming the same
#9Semiconductor chip, method for manufacturing semiconductor chip, integrated circuit device, and method for manufacturing integrated circuit device
#10Semiconductor device
#11Dense redistribution layers in semiconductor packages and methods of forming the same
#12Semiconductor contact
#13Semiconductor device
#14Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductor
#15Semiconductor device having improved RF characteristics and moisture resistance and method for manufacturing the same
#16Method for establishing and closing a trench of a semiconductor component
#17Semiconductor chip with flexible contacts at a face
#18Semiconductor device and method of manufacturing semiconductor device