207677 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Lead-frames or other flat leads characterised by the die pad an insulative substrate being used as a diepad, e.g. ceramic, plastic
SUBSTRATE WITH STEPPED CONDUCTIVE LAYER SURFACE
#2INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT ASSEMBLIES
#3GATE DRIVER, INSULATION MODULE, LOW-VOLTAGE CIRCUIT UNIT, AND HIGH-VOLTAGE CIRCUIT UNIT
#4MICROELECTRONIC DEVICE PACKAGE WITH MULTILAYER PACKAGE SUBSTRATE
#5PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
#6INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
#7CERAMIC CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME
#8POWER MODULE HAVING A LEAD FRAME THAT PROVIDES SUBSTRATE SUPPORT AND FORMS TERMINALS OF THE POWER MODULE
#9SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
#10PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP ON ENCAPSULANT
#11INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT ASSEMBLIES
#12HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
#13SEMICONDUCTOR MODULE ARRANGEMENTS
#14CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD FOR PRODUCING A CARRIER
#15SEMICONDUCTOR DEVICE
#16METHOD FOR FORMING A TERMINAL ELEMENT, TERMINAL ELEMENT, AND POWER SEMICONDUCTOR MODULE ARRANGEMENT HAVING A TERMINAL ELEMENT
#17SEMICONDUCTOR MODULE
#18SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
#19Package with electrically insulated carrier and at least one step on encapsulant
#20SEMICONDUCTOR DEVICE
#21Molded semiconductor package having an embedded inlay
#22GATE DRIVER, INSULATION MODULE, LOW-VOLTAGE CIRCUIT UNIT, AND HIGH-VOLTAGE CIRCUIT UNIT
#23Semiconductor module
#24TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING, LEAD FRAME PROVIDED WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATION MOLDED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
#25SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#26Method of manufacturing semiconductor devices and corresponding semiconductor device
#27Semiconductor device with galvanically isolated semiconductor chips
#28Heat-dissipating wirebonded members on package surfaces
#29Semiconductor module
#30Semiconductor device comprising a drain back contact electrode, method of manufacturing the same, and semiconductor package structure
#31Package with electrically insulated carrier and at least one step on encapsulant
#32Leadframe package with isolation layer
#33Memory modules and memory packages including graphene layers for thermal management
#34Semiconductor device package and the method of manufacturing the same
#35Power module and method of manufacturing same
#36Method of manufacturing semiconductor devices and corresponding semiconductor device
#37SENSING DEVICE AND MANUFACTURING METHOD THEREOF
#38Bidirectional switch and bidirectional switch device including the switch
#39Semiconductor module
#40Semiconductor device package assemblies and methods of manufacture
#41Memory modules and memory packages including graphene layers for thermal management
#42Robust electronics mounting device
#43Use of thin film metal with stable native oxide for solder wetting control
#44Multi-layer die attachment
#45Robust integrated circuit package
#46Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate
#47Semiconductor power device including ring frame for thermal impedance reduction
#48Current sensor isolation
#49Multi-layer die attachment
#50Rectifier IC and insulation type switching power supply using the same
#51BICONTINUOUS POROUS CERAMIC COMPOSITE FOR SEMICONDUCTOR PACKAGE APPLICATIONS
#52Dual-sided integrated fan-out package
#53Rectifier IC and insulation type switching power supply using the same
#54High-power acoustic device with improved performance
#55Semiconductor device including antistatic die attach material
#56Semiconductor device and corresponding method
#57Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#58Bumpless wafer level fan-out package
#59Dual-sided integrated fan-out package
#60Methods for magnetic sensor having non-conductive die paddle
#61Chip package method for reducing chip leakage current
#62Cavity package with die attach pad
#63Leadframe
#64Package structure and the method to fabricate thereof
#65Devices and methods related to high power diode switches with low DC power consumption
#66Integrated package design with wire leads for package-on-package product
#67Semiconductor module with conductive pin
#68Cavity package with composite substrate
#69Substrate interposer on a leadframe
#70Current sensor isolation
#71Apparatus and methods for radio frequency PIN diode switches
#72Semiconductor module with mounting case and method for manufacturing the same
#73Semiconductor package design providing reduced electromagnetic coupling between circuit components
#74Power module and fabrication method for the same
#75Method of producing a semiconductor package
#76Electronic device having a lead with selectively modified electrical properties
#77Methods and apparatus for magnetic sensor having non-conductive die paddle
#78SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDUCTOR PACKAGE
#79Multilayer ceramic substrate and manufacturing thereof
#80Power semiconductor package
#81High pin count, small packages having heat-dissipating pad
#82Printed circuit board and stacked semiconductor device
#83Semiconductor device including a sealing region
#84Semiconductor device and method of assembling same
#85Wiring board unit, manufacturing method thereof, and manufacturing method of wiring board with lead
#86System, method and apparatus for leadless surface mounted semiconductor package
#87Power semiconductor package
#88Cavity package with die attach pad
#89Low CTE interposer without TSV structure
#90Chip-on-lead package and method of forming
#91Semiconductor device with resin mold
#92Integrated circuit package
#93Method for bonding of group III-nitride device-on-silicon and devices obtained thereof
#94Graphite-containing substrates for LED packages
#95Methods and apparatus for magnetic sensor having non-conductive die paddle
#96Semiconductor device and method of assembling same
#97Semiconductor package including interposer with through-semiconductor vias
#98Semiconductor package with interposer
#99Semiconductor package design providing reduced electromagnetic coupling between circuit components
#100Wiring substrate and semiconductor device
#101System, method and apparatus for leadless surface mounted semiconductor package
#102Semiconductor package including an organic substrate and interposer having through-semiconductor vias
#103Package structure and the method to fabricate thereof
#104PROTECTIVE LAYERS IN SEMICONDUCTOR PACKAGING
#105Methods and apparatus for magnetic sensor having non-conductive die paddle
#106Chip-on-lead package and method of forming
#107Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#108Optical semiconductor element package and optical semiconductor device
#109Semiconductor device with resin mold
#110High pin count, small SON/QFN packages having heat-dissipating pad
#111Integrated circuit package system with package stand-off and method of manufacture thereof
#112Light Emitting Diode Package Structure and Manufacturing Method Therefor
#113Semiconductor die containing lateral edge shapes and textures
#114Encapsulant interposer system with integrated passive devices and manufacturing method therefor
#115Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices
#116Encapsulant interposer system with integrated passive devices and manufacturing method therefor
#117High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies
#118Semiconductor device and method
#119Light emitting diode package structure and manufacturing method therefor
#120Semiconductor device with resin mold
#121Packaged microchip with spacer for mitigating electrical leakage between components
#122Multi-chip electronic package with reduced stress
#123Semiconductor package
#124Method of producing a semiconductor package
#125High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies
#126Methods for a multiple die integrated circuit package
#127Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#128Semiconductor device
#129Methods for a multiple die integrated circuit package
#130Multi-part lead frame with dissimilar materials
#131Multi-part lead frame with dissimilar materials
#132Multi-part lead frame with dissimilar materials
#133Semiconductor device and method of manufacturing the same
#134Semiconductor device and a manufacturing method of the same
#135Stack semiconductor package formed by multiple molding and method of manufacturing the same
#136Multi-part lead frame with dissimilar materials
#137Semiconductor device and a method of manufacturing the same
#138Multi-part lead frame
#139Multi-part lead frame with dissimilar materials
#140Semiconductor device and manufacturing method of semiconductor device
#141Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same
#142Lead frame structure for light emitting diode
#143Dual-sided integrated fan-out package