207688 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Lead-frames or other flat leads; Geometry of the lead-frame Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
LEAD-WIRE FRAME STRUCTURE FOR PACKAGING AND SENSOR PACKAGE STRUCTURE
#2LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP
#3SEMICONDUCTOR DEVICE
#4ELECTRONIC DEVICE
#5SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG AND ISOLATION
#6SLOTTED CLIPS FOR REDUCTION OF MOLDING COMPOUND DELAMINATION
#7ELECTRONIC DEVICE WITH LEAD LOCK
#8ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND LEAD FRAME
#9SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE
#10LEAD FRAME AND PACKAGE METHOD
#11LEAD FRAME APPARATUS, SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE
#12SEMICONDUCTOR DEVICE
#13LEAD FRAME AND PACKAGING METHOD
#14METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICONDUCTOR DEVICE AND ASSORTMENT OF SEMICONDUCTOR DEVICES
#15SEMICONDUCTOR DEVICE
#16Semiconductor device comprising first and second lead frames
#17Electronic device with die pads and leads
#18Semiconductor device
#19Power module package casing with protrusion supports
#20LOADING FRAME FOR HIGH I/O COUNT PACKAGED SEMICONDUCTOR CHIP
#21Method for manufacturing a semiconductor device having a semiconductor element mounted on a lead frame
#22Electronic device with die pad and leads, and method of manufacturing
#23Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture
#24Packaged device having selective lead pullback for dimple depth control
#25RESIN ENCAPSULATING MOLD AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#26Semiconductor systems having dual leadframes
#27Wire bond clamp design and lead frame capable of engaging with same
#28Semiconductor memory device
#29Semiconductor device
#30Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture
#31Lead frame and method for manufacturing the same
#32Power semiconductor module
#33SEMICONDUCTOR DEVICE
#34Method for making semiconductor device with sidewall recess and related devices
#35Semiconductor package
#36Leadframe
#37LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS
#38Lead frame and method of producing a chip housing
#39Lead frame including a plurality of units connected together and semiconductor device including the lead frame
#40Wiring circuit board and method of manufacturing the same
#41Semiconductor package including a device and lead frame used for the same
#42Leadframe and semiconductor device
#43Semiconductor systems having premolded dual leadframes
#44Leadframe
#45Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
#46Semiconductor device
#47Semiconductor component and method of manufacture
#48Method for making semiconductor device with sidewall recess and related devices
#49Semiconductor package
#50Lead frame
#51Method of manufacturing semiconductor device
#52Non-planar inductive electrical elements in semiconductor package lead frame
#53Semiconductor device and lead frame used for the same
#54Semiconductor device
#55Micro lead frame structure having reinforcing portions and method
#56Conductor strip with contact areas having cutouts
#57Package in package (PiP) electronic device and manufacturing method thereof
#58Semiconductor device having lead frame with notched inner leads
#59High reliability semiconductor package structure
#60Semiconductor package including a connecting member
#61Strengthened LED package and method therefor
#62Semiconductor device
#63Semiconductor device leadframe
#64Wiring board unit, manufacturing method thereof, and manufacturing method of wiring board with lead
#65Printed wiring board
#66Method for bonding of group III-nitride device-on-silicon and devices obtained thereof
#67Semiconductor module
#68Electronic component device
#69Semiconductor device
#70Semiconductor device and manufacturing method of the same
#71Lead frame, semiconductor manufacturing apparatus, and semiconductor device
#72Lead frame having a flag with in-plane and out-of-plane mold locking features
#73Semiconductor device and method of manufacturing the same
#74Wiring board and electronic component device
#75Semiconductor device comprising thin-film terminal with deformed portion
#76Semiconductor device and lead frame used for the same
#77Semiconductor device and manufacturing method of the same
#78Semiconductor device and manufacturing method of the same
#79Wiring board and electronic component device
#80LEAD FRAME
#81Solid-state image sensing apparatus and package of same
#82Semiconductor device and manufacturing method of the same
#83SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR THE SAME
#84Stress-Resistant Leadframe and Method
#85CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
#86Microelectronic component assemblies having lead frames adapted to reduce package bow
#87Lead frame and semiconductor device having the same as well as method of resin-molding the same
#88Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture
#89Flexible substrate with crimping interconnection